System and method for resetting a reaction mass assembly of a stage assembly

ABSTRACT

A stage assembly for moving and positioning a device is provided herein. The stage assembly includes a stage base, a stage, a stage mover assembly, a reaction mass assembly, a reaction mover assembly, and a control system. The stage mover assembly moves the stage relative to the stage base. The reaction mass assembly reduces the reaction forces created by the stage mover assembly that are transferred to the stage base. The reaction mover assembly adjusts the position of the reaction mass assembly relative to the stage base. Uniquely, the control system controls and directs current to the reaction mover assembly in a way that minimizes the influence of disturbances created by the reaction mover assembly on the stage assembly. More specifically, the timing and/or the amount of current from the control system directed to the reaction mover assembly is varied to minimize the influence of the disturbances created by the reaction mover assembly on the stage assembly. With this design, the reaction mover assembly has less influence upon the position of the stage base. This allows for more accurate positioning of the device by the stage assembly and better performance of the stage assembly.

[0001] This application is a continuation-in-part of U.S. patentapplication Ser. No. 09/714,598, filed Nov. 16, 2000, and of U.S. patentapplication Ser. No. 09/739,772, filed Dec. 20, 2000, the entiredisclosures of which are incorporated herein by reference.

CROSS REFERENCE TO RELATED APPLICATIONS

[0002] As far as permitted, the disclosures of (i) U.S. patentapplication Ser. No.______, entitled, “STAGE ASSEMBLY INCLUDING AREACTION MASS ASSEMBLY,” filed on the same day as the presentApplication, docket no. PA0287-US/11269.15, (ii) U.S. patent applicationSer. No.______, entitled “STAGE ASSEMBLY INCLUDING A REACTION ASSEMBLY,”filed on the same day as the present Application, docket no.PA0283-US/11269.17, and (iii) U.S. patent application Ser. No.______,entitled “STAGE ASSEMBLY INCLUDING A REACTION ASSEMBLY THAT IS CONNECTEDBY ACTUATORS,” filed on the same day as the present Application, docketno. PA0319-US/11269.25, are incorporated herein by reference.

BACKGROUND OF THE INVENTION

[0003] 1. Field of Invention

[0004] The present invention is directed to a stage assembly for movinga device. More specifically, the present invention is directed to astage assembly including a reaction mass assembly and a system andmethod for resetting the reaction mass assembly. The present inventionalso relates to an exposure apparatus and method, and more particularlyto an exposure apparatus and method for transferring a pattern onto asubstrate by irradiation of an exposure beam.

[0005] 2. Description of Related Art

[0006] Various types of exposure apparatus are conventionally used inphotolithographic processes for manufacturing semiconductor devices,liquid crystal display devices, and the like. In recent years, astep-and-repeat reduction projection exposure apparatus (a so-called“stepper”), a step-and-scan scan-exposure apparatus (a so-called“scanning stepper”), and the like have been widely used.

[0007] Exposure apparatuses are commonly used to transfer images from areticle onto a semiconductor wafer during semiconductor processing. Atypical exposure apparatus includes an illumination source, a reticlestage assembly that retains a reticle, a lens assembly and a wafer stageassembly that retains a semiconductor wafer. The reticle stage assemblyand the wafer stage assembly are supported above a ground with anapparatus frame.

[0008] Typically, the wafer stage assembly includes a wafer stage base,a wafer stage that retains the wafer, and a wafer stage mover assemblythat precisely positions the wafer stage and the wafer. Somewhatsimilarly, the reticle stage assembly includes a reticle stage base, areticle stage that retains the reticle, and a reticle stage moverassembly that precisely positions the reticle stage and the reticle. Thesize of the images transferred onto the wafer from the reticle isextremely small. Accordingly, the precise relative positioning of thewafer and the reticle is critical to the manufacturing of high density,semiconductor wafers.

[0009] Unfortunately, the wafer stage mover assembly generates reactionforces that can vibrate the wafer stage base and the apparatus frame.The vibration influences the position of the wafer stage base, the waferstage, and the wafer. As a result thereof, the vibration can cause analignment error between the reticle and the wafer. This reduces theaccuracy of positioning of the wafer relative to the reticle anddegrades the accuracy of the exposure apparatus. Reaction forcesproduced due to driving of the wafer stage is mechanically caused toescape to the floor (the ground) by a frame member placed on a base(e.g., a floor surface or a base plate of the apparatus) which isvibration-isolated from the stage, as disclosed in, for example, U.S.Pat. No. 5,528,118.

[0010] In the case of the scanning stepper, a reticle stage as well as awafer stage needs to be driven in a predetermined scanning direction bya linear motor or the like. In order to absorb reaction forces produceddue to driving of the reticle stage, a countermass mechanism for onescanning direction, which functions based on the law of conservation ofmomentum, is typically adopted (see, for example, U.S. patentapplication Ser. No. 09/260,544). The reaction force produced due todriving of the reticle stage can also be mechanically transferred to thebase, that is, the floor (the ground) by using a frame member (see, forexample, U.S. Pat. No. 5,874,820).

[0011] In conventional projection exposure apparatus, the reaction forceof the stage to be transferred to the base is damped by avibration-isolating device, such as an anti-vibration table, so as toreduce vibration of a projection optical system (projection lens) andvibration of the stage transmitted via the base due to the reactionforce. Although the reaction force is damped by being transferred to thebase, a nontrivial amount of vibration, from the viewpoint of the levelrequired under current micro-fabrication requirements, is given to theprojection optical system and to the stage. Such vibration resultingfrom the reaction force deteriorates exposure accuracy of a scanningstepper that performs an exposure operation while scanning a stage (anda wafer or a reticle).

[0012] While transmission of reaction force can be substantiallycompletely prevented by absorbing the reaction force by the countermassmechanism, the conventional countermass mechanism employs a countermassthat moves in a direction opposite from the driving direction of a stageby a distance proportional to the driving distance of the stage. Forthis reason, the stroke of the countermass must be set in accordancewith (in proportion to) the total stroke of the stage, which increasesthe size of the exposure apparatus.

[0013] In light of the above, one object of the present invention is toprovide a stage assembly that precisely positions a device. Anotherobject is to provide a stage assembly that minimizes the influence ofthe reaction forces of the stage mover assembly upon the position of thestage, the stage base, and the apparatus frame. Still another object isto provide a stage assembly having an improved reaction mass assembly.Another object is to provide an improved system and method for resettingthe position of a reaction mass assembly. Yet another object is toprovide an exposure apparatus capable of manufacturing precision devicessuch as high density, semiconductor wafers.

SUMMARY OF THE INVENTION

[0014] The invention has been made in view of the above circumstances,and it is one object of the invention to provide an exposure apparatusand method that allows precise exposure without increasing the size ofthe exposure apparatus.

[0015] The present invention is directed to a method and apparatus forresetting a reaction mass assembly of a stage assembly. The stageassembly is useful with an apparatus to sequentially position a devicefor one or more manufacturing operations performed by the apparatus. Thestage assembly includes a stage, a stage mover assembly, a reaction massassembly, a reaction mover assembly and a control system. The stageretains the device. The stage mover assembly moves the stage relative toa stage base. The reaction mass assembly reduces and minimizes theamount of reaction forces from the stage mover assembly that aretransferred to the stage base.

[0016] The reaction mover assembly moves the reaction mass assemblyrelative to the stage base to reset the position of the reaction massassembly. More specifically, the control system directs and controlscurrent to the reaction mover assembly (i) to control the position ofthe reaction mass assembly, (ii) to prevent the reaction mass assemblyfrom achieving a constant velocity, (iii) to correct externaldisturbances that can influence the position of the reaction massassembly, and (iv) to prevent the center of gravity of the stageassembly from shifting.

[0017] Preferably, the control system controls current to the reactionmover assembly based upon the status of the one or more operationsperformed by the apparatus. This allows the control system to controland direct current to the reaction mover assembly in a way thatminimizes the disturbances created by the reaction mover assembly on thestage assembly and the apparatus. More specifically, the timing and/orthe amount of current from the control system directed to the reactionmover assembly is varied to minimize the influence of the disturbancescreated by the reaction mover assembly on the stage assembly. The timingand/or amount of current can also be varied according the type ofoperations performed by the apparatus.

[0018] In one embodiment of the present invention, the control systemdoes not direct current to the reaction mover assembly during at leastone of the operations performed by the apparatus and the control systemdirects current to the reaction mover assembly between the operationsperformed by the apparatus. In this embodiment, the control systemcontrols and directs current to the reaction mover assembly so that thereaction mover assembly only moves and corrects the position of thereaction mass assembly at selected times or intervals.

[0019] For example, if the stage assembly is utilized for an exposureapparatus, the reaction mover assembly can be activated betweenexposures and deactivated during an exposure. Stated another way, forthe exposure apparatus, the control system can be designed to directcurrent to the reaction mover assembly when an illumination system is inan off position and not direct current when the illumination system isin an on position. In the on position, the illumination source directs abeam of light energy towards the stage assembly. In contrast, in the offposition, the illumination source does not direct a beam of light energytowards the stage assembly. Thus, the control system controls current tothe reaction mover assembly based upon the position of the illuminationsource.

[0020] In this embodiment, the control system can direct current to thereaction mover assembly (i) between the forming of each image on thedevice, e.g. each chip on a semiconductor wafer, (ii) between theforming of each row of images on the device, e.g. each row of chips onthe wafer, (iii) between every scan of the device, or (iv) between eachdevice or wafer processed by the exposure apparatus. Because thereaction mover assembly is not activated during an exposure, thedisturbances created by the reaction mover assembly do not significantlyinfluence the position of the stage assembly.

[0021] In another embodiment of the present invention, the controlsystem can direct current to the reaction mover assembly so that therate of movement by the reaction mover assembly is greater between eachoperation performed by the apparatus than during each operation. In thisembodiment, the control system controls and directs current to thereaction mover assembly so that the reaction mover assembly makes onlyrelatively small corrections to the position of the reaction massassembly at selected times or intervals and the reaction mover assemblymakes relatively large corrections to the position of the reaction massassembly between these selected times or intervals.

[0022] For an exposure apparatus, the control system can control anddirect current to the reaction mover assembly at a different rate duringan exposure than between exposures. For example, during an exposure, thecontrol system directs current to the reaction mover assembly so thatthe forces generated by the reaction mover assembly are relatively smalland the gain is low. Alternately, between exposures, the control systemdirects current to the reaction mover assembly so that the forcesgenerated by the reaction mover assembly are relatively large and thegain is high.

[0023] As provided herein, the control system can direct a relativelylarge current to the reaction mover assembly (i) between the forming ofeach image on the device, e.g. each chip on a semiconductor wafer, (ii)between the forming of each row of images on the device, e.g. each rowof chips on the wafer, (iii) between every scan of the device, or (iv)between each device or wafer processed by the exposure apparatus. Withthis design, the reaction mover assembly makes relatively largeadjustments to the position of the reaction mass assembly when theillumination source is in the off position and makes relatively smalladjustments to the position of the reaction mass assembly when theillumination source is in the on position. Thus, the control systemdirects more current to the reaction mover assembly when theillumination source is in the off position than when the illuminationsource is in the on position.

[0024] Because the reaction mover assembly makes only sight movementsduring an exposure, the disturbances created by the reaction moverassembly do not significantly influence the position of the stageassembly.

[0025] The present invention is also directed to a method for making astage assembly, a method for making an exposure apparatus, a method formaking a device and a method for manufacturing a wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The novel features of this invention, as well as the inventionitself, both as to its structure and its operation, will be bestunderstood from the accompanying drawings, taken in conjunction with theaccompanying description, in which similar reference characters refer tosimilar parts, and in which:

[0027]FIG. 1 is a perspective view of a first embodiment of a stageassembly having features of the present invention;

[0028]FIG. 2 is a top plan view of the stage assembly of FIG. 1;

[0029]FIG. 3 is a front plan view of the stage assembly of FIG. 1;

[0030]FIG. 4 is a perspective view of a stage having features of thepresent invention;

[0031]FIG. 5A is a perspective view of a device table having features ofthe present invention;

[0032]FIG. 5B is a top plan view of the device table of FIG. 5A;

[0033]FIG. 6A illustrates a perspective view of a pair ofelectromagnetic actuators having features of the present invention;

[0034]FIG. 6B illustrates an exploded perspective view of the actuatorsof FIG. 6A;

[0035]FIG. 7A is a simplified, schematic top view of a portion of astage assembly;

[0036]FIG. 7B is another, simplified schematic top view of a portion ofthe stage assembly;

[0037]FIG. 7C is a simplified block diagram that illustrates theoperation of a control system having features of the present invention;

[0038]FIG. 8 is a perspective view of a second embodiment of a stageassembly having features of the present invention;

[0039]FIG. 9 is a top plan view of the stage assembly of FIG. 8;

[0040]FIG. 10 is an exploded perspective view of a reaction massassembly illustrated in FIG. 8;

[0041]FIG. 11 is a perspective view of a third embodiment of a stageassembly having features of the present invention;

[0042]FIG. 12 is a perspective view of a reaction mass assemblyillustrated in FIG. 11;

[0043]FIG. 13 is an exploded perspective view of the reaction massassembly of FIG. 11;

[0044]FIG. 14 is a perspective view of a fourth embodiment of a stageassembly having features of the present invention;

[0045]FIG. 15 is a perspective view of a reaction mass assemblyillustrated in FIG. 14;

[0046]FIG. 16 is an exploded perspective view of the reaction massassembly of FIG. 15;

[0047]FIG. 17A is a simplified schematic top view of a portion of astage assembly;

[0048]FIG. 17B is a simplified block diagram that illustrates theoperation of a control system having features of the present invention;

[0049]FIG. 18 is a schematic illustration of an exposure apparatushaving features of the present invention;

[0050]FIG. 19 is a flow chart that outlines a process for manufacturinga device in accordance with the present invention; and

[0051]FIG. 20 is a flow chart that outlines device processing in moredetail.

[0052]FIG. 21 is a schematic view showing the configuration of anexposure apparatus according to an embodiment of the invention;

[0053]FIG. 22 is a perspective view of a wafer stage assembly shown inFIG. 21;

[0054]FIG. 23 is a partly broken view of a wafer stage and a waferdriving device shown in FIG. 22;

[0055]FIG. 24A is a cross-sectional view, taken along line D-D in FIG.22;

[0056]FIG. 24B is an explanatory view of an X-axis stationary member anda frame shown in FIG. 22, as viewed from the +X-axis direction;

[0057]FIG. 25 is a partly broken view of an X-axis moving member shownin FIG. 23, in which the X-axis stationary member is omitted;

[0058]FIG. 26 is an explanatory view of an X restraint mechanism;

[0059]FIG. 27 is an explanatory view showing the positions of thecenters of gravity of the wafer stage and the wafer driver;

[0060]FIG. 28 is an explanatory view illustrating an exposure processfor a wafer;

[0061]FIG. 29 is a schematic structural view of an exposure apparatusaccording to a modification of the first embodiment; and

[0062]FIG. 30 is an explanatory view of a wafer stage assembly shown inFIG. 29.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0063] Referring initially to FIG. 1, a stage assembly 10, havingfeatures of the present invention, includes a stage base 12, at leastone stage 14 (two are illustrated), a stage mover assembly 16, areaction mass assembly 18, a measurement system 20 (only a portion isillustrated in FIG. 1), and a control system 22. The stage assembly 10is positioned above a mounting base 24 (illustrated in FIG. 18). As anoverview, the stage mover assembly 16 precisely moves each stage 14relative to the stage base 12. Further, the reaction mass assembly 18reduces and minimizes the amount of reaction forces from the stage moverassembly 16 that are transferred to the stage base 12 and the mountingbase 24.

[0064] The stage assembly 10 is particularly useful for preciselypositioning a device 26 during a manufacturing and/or an inspectionprocess. The type of device 26 positioned and moved by the stageassembly 10 can be varied. For example, the device 26 can be asemiconductor wafer 28, and the stage assembly 10 can be used as part ofan exposure apparatus 30 (illustrated in FIG. 18) for preciselypositioning the semiconductor wafer 28 during manufacturing of thesemiconductor wafer 28. Alternately, for example, the stage assembly 10can be used to move other types of devices during manufacturing and/orinspection, to move a device under an electron microscope (not shown),or to move a device during a precision measurement operation (notshown).

[0065] Some of the Figures provided herein include a coordinate systemthat designates an X axis, a Y axis, and a Z axis. It should beunderstood that the coordinate system is merely for reference and can bevaried. For example, the X axis can be switched with the Y axis and/orthe stage assembly 10 can be rotated.

[0066] A number of alternate embodiments of the stage assembly 10 areillustrated in the Figures. In particular, FIG. 1 illustrates aperspective view of a first embodiment of the stage assembly 10, FIG. 8illustrates a perspective view of a second embodiment of the stageassembly 10, FIG. 11 illustrates a perspective view of a thirdembodiment of the stage assembly 10, and FIG. 14 illustrates aperspective view of a fourth embodiment of the stage assembly 10.

[0067] In each embodiment illustrated herein, each stage 14 is movedrelative to the stage base 12 along the X axis, along the Y axis, andabout the Z axis (collectively “the planar degrees of freedom”). Morespecifically, the stage mover assembly 16 moves and positions each stage14 along the X axis, along the Y axis, and about the Z axis under thecontrol of the control system 22. Additionally, in each embodimentillustrated, the stage assembly 10 includes two stages 14 thatindependently move relative to the stage base 12. Alternately, however,each stage assembly 10 could include only one stage 14 or more than twostages 14.

[0068] Importantly, the reaction mass assembly 18 reduces and minimizesthe amount of reaction force from the stage mover assembly 16 that aretransferred to the stage base 12 and the mounting base 24. As anoverview, in the embodiments provided herein, the reaction mass assembly18 includes an X reaction component 33A and a Y reaction component 33B.The X reaction component 33A moves relative to the stage base 12 with atleast two degrees of freedom and more preferably, three degrees offreedom. The Y reaction component 33B moves relative to the stage base12 with at least one degree of freedom and more preferably three degreesof freedom.

[0069] Further, in the embodiments provided herein, the X reactioncomponent 33A is coupled to the Y reaction component 33B and movesrelative to the Y reaction component 33B along the X axis. Additionally,the X reaction component 33A and the Y reaction component 33B moveconcurrently along the Y axis relative to the stage base 12. In some ofthe embodiments, the X reaction component 33A and the Y reactioncomponent 33B also move concurrently along the X axis and about the Zaxis relative to the stage base 12.

[0070] In a preferred embodiment of the present invention, the reactionmass assembly 18 is free to move along the X axis, along the Y axis, andabout the Z axis relative to the stage base 12. In this embodiment, whenthe stage mover assembly 16 applies a force to the stage 14 along the Xaxis, the Y axis, and/or about the Z axis, an equal and opposite forceis applied to the reaction mass assembly 18. Further, the control system22 corrects the position of the reaction mass assembly 18 along the Xaxis, along the Y axis, and about the Z axis.

[0071] The reaction mass assembly 18 provided herein, minimizes thedisturbance that is transferred to the stage base 12. This improves thepositioning performance of the stage assembly 10. Further, for anexposure apparatus 30, this allows for more accurate positioning of thesemiconductor wafer 28 relative to a reticle 32 (illustrated in FIG.18).

[0072] The stage base 12 supports a portion of the stage assembly 10above the mounting base 24. The design of the stage base 12 can bevaried to suit the design requirements of the stage assembly 10. In theembodiment illustrated in FIGS. 1-3, the stage base 12 is generallyrectangular shaped and includes a planar base top 34 (sometimes referredto as a guide face), an opposed planar base bottom 36, four base sides38, and a plurality of spaced apart base fluid pads 40 (illustrated inFIG. 3). The base fluid pads 40 are secured to base top 34.

[0073] In this embodiment, the reaction mass assembly 18 is maintainedabove the stage base 12 with a vacuum type fluid bearing. Morespecifically, in this embodiment, each of the base fluid pads 40includes a plurality of spaced apart fluid outlets (not shown), and aplurality of spaced apart fluid inlets (not shown). Pressurized fluid(not shown) is released from the fluid outlets towards a reaction base42 of the Y reaction component 33B of the reaction mass assembly 18. Avacuum is pulled in the fluid inlets to create a vacuum preload type,fluid bearing between the base top 34 and the reaction base 42. Thevacuum preload type fluid bearing maintains the reaction mass assembly18, spaced apart along the Z axis, relative to the stage base 12.Further, the vacuum preload type fluid bearing allows for motion of theX reaction component 33A, and the Y reaction component 33B along the Xaxis, along the Y axis, and about the Z axis relative to the stage base12.

[0074] Alternately, the reaction mass assembly 18 can be supportedspaced apart from the stage base 12 in other ways. For example, amagnetic type bearing or a ball bearing type of assembly could beutilized that allows for motion of the reaction mass assembly 18relative to the stage base 12.

[0075] Preferably, referring to FIG. 18, the stage base 12 is securedwith resilient base isolators 44 and an apparatus frame 46 to themounting base 24. The base isolators 44 reduce the effect of vibrationof the apparatus frame 46 causing vibration on the stage base 12.Typically, three or four spaced apart base isolators 44 are utilized.Each base isolator 44 can include a pneumatic cylinder (not shown) andan actuator (not shown). Suitable base isolators 44 are sold byTechnical Manufacturing Corporation, located in Peabody, Mass., orNewport Corporation located in Irvine, Calif.

[0076] The stage 14 retains the device 26. The stage 14 is preciselymoved by the stage mover assembly 16 to precisely position the device26. The design of each stage 14 can be varied to suit the designrequirements of the stage assembly 10. A perspective view of one of thestages 14 is provided in FIG. 4. In this embodiment, the stage 14includes a device table 48, a guide assembly 50, a portion of the stagemover assembly 16, and a portion of the measurement system 20. Thedesign of each stage 14 illustrated in FIGS. 1-3 is substantially thesame as the stage 14 illustrated in FIG. 4. Accordingly, the presentdiscussion describes only one of the stages 14.

[0077] The design and movement of the device table 48 for each stage 14can be varied to suit the design requirements of the stage assembly 10.In the embodiment illustrated in FIGS. 1-4, the device table 48 movesrelative to the guide assembly 50 along the Y axis. Further, the devicetable 48 includes: (i) an upper table component 52, (ii) a lower tablecomponent 54 positioned below the upper table component 52, (iii) a pairof spaced apart table fluid pads 56 (only one is illustrated in FIG. 4)positioned below the lower table component 54.

[0078] The upper table component 52 is generally rectangular shaped andincludes a table top 58, a table bottom 60, four table sides 62 (onlytwo sides are illustrated in the Figures), and a device holder 63(illustrated in FIGS. 5A and 5B). The device holder 63 is positionednear the table top 58 and retains the device 26 during movement of thestage 14. The device holder 63 can be a vacuum chuck, an electrostaticchuck, or some other type of clamp.

[0079] The lower table component 54 includes a generally rectangulartube shaped outer guide section 64, and generally rectangular tubeshaped inner guide section 65. The outer guide section 64 is positionedbelow the upper table component 52. The outer guide section 64 defines agenerally rectangular shaped guide channel 66 that is sized and shapedto receive a portion of the guide assembly 50. The guide channel 66defines a pair of spaced apart side guide surfaces 68. The outer guidesection 64 also includes a plurality of section apertures 70 that extendtransversely through the outer guide section 64 to reduce the weight ofthe outer guide section 64.

[0080] Additionally, the outer guide section 64 includes a pair ofspaced apart, section fluid pads 72 (only one is illustrated in theFigures) that are positioned along the side guide surfaces 68 in theguide channel 66. In this embodiment, each section fluid pad 72 includesa plurality of spaced apart fluid outlets (not shown). Pressurized fluid(not shown) is released from the fluid outlets towards the guideassembly 50 to create a fluid bearing between the device table 48 andthe guide assembly 50. The fluid bearing maintains the device table 48spaced apart from the guide assembly 50 along the X axis and allows formotion of the device table 48 along the Y axis relative to the guideassembly 50.

[0081] The inner guide section 65 is positioned within the guide channel66, below the upper table component 52. The inner guide section 65defines a generally rectangular shaped opening 74 that is sized andshaped to receive a portion of the guide assembly 50. Stated anotherway, the inner guide section 65 encircles a portion of the guideassembly 50. In the embodiments provided herein, the inner guide section65 supports a portion of the stage mover assembly 16 as provided below.

[0082] The table fluid pads 56 extend downwardly from the lower tablecomponent 54. Each table fluid pad 56 includes a plurality of spacedapart fluid outlets (not shown), and a plurality of spaced apart fluidinlets (not shown). Pressurized fluid (not shown) is released from thefluid outlets towards the reaction base 42 of the reaction mass assembly18. A vacuum is pulled in the fluid inlets to create a vacuum preloadtype fluid bearing between the table fluid pads 56 and the reaction base42. The vacuum preload type fluid bearing maintains the device table 48spaced apart along the Z axis relative to the reaction base 42. Further,the vacuum preload type fluid bearing allows for motion of the devicetable 48 along the X axis, along the Y axis, and about the Z axisrelative to the reaction base 42.

[0083] Alternately, the device table 48 can be supported above thereaction base 42 in other ways. For example, a magnetic type bearing ora ball bearing type of assembly could be utilized that allows formovement of the device table 48 relative to the reaction base 42.

[0084]FIGS. 5A and 5B illustrate an alternate embodiment of a devicetable 48 having features of the present invention. In this design, thedevice table 48 includes a table mover assembly 75. Further, in thisdesign, the upper table component 52 is moveable relative to the lowertable component 54. More specifically, the table mover assembly 75adjusts the position of the upper table component 52 relative to thelower table component 54 of the device table 48.

[0085] The design of the table mover assembly 75 can be varied to suitthe design requirements to the stage assembly 10. In the embodimentillustrated in FIGS. 5A and 5B, the table mover assembly 75 adjusts theposition of the upper table component 52 and the device holder 63relative to the lower table component 54 with six degrees of freedom.Alternately, for example, the table mover assembly 75 can be designed tomove the upper table component 52 relative to the lower table component54 with only three degrees of freedom. The table mover assembly 75 caninclude one or more rotary motors, voice coil motors, linear motors,electromagnetic actuators 79, or some other force actuators.

[0086] In the embodiment illustrated in FIGS. 5A and 5B, the table moverassembly 75 includes three spaced apart, horizontal table movers 76 andthree spaced apart, vertical table movers 78. The horizontal tablemovers 76 move the upper table component 52 along the X axis, along theY axis, and about the Z axis relative to the lower table component 54.The vertical table movers 78 move the upper table component 52 about theX axis, about the Y axis, and along the Z axis relative to the lowertable component 54.

[0087] The design of each table mover 76, 78 can be varied. In theembodiment illustrated in the Figures, each of the horizontal tablemovers 76 includes a pair of electromagnetic actuators 79, and each ofthe vertical table movers 78 is a non-commutated actuator commonlyreferred to as a voice coil actuator.

[0088]FIGS. 6A and 6B illustrate a perspective view of a preferred pairof electromagnetic actuators 79. More specifically, FIG. 6A illustratesa perspective view of a pair of electromagnetic actuators 79 commonlyreferred to as an E/I core actuators 214, and FIG. 6B illustrates anexploded perspective view of the E/I core actuators 214. Each E/I coreactuator 214 is essentially an electromagnetic attractive device. EachE/I core actuator 214 includes an E shaped core 80, a tubular conductor81, and an I shaped core 82. The E core 80 and the I core 82 are eachmade of a magnetic material such as iron, silicon steel, or Ni—Fe steel.The conductor 81 is positioned around the center bar of the E core 80.The combination of the E core 80 and the conductor 81 is sometimesreferred to herein as an electromagnet. Further, the I core 82 issometimes referred to herein as a target.

[0089] Each electromagnet and target is separated by an air gap g (whichis very small and therefore difficult to see in the figures). Theelectromagnets are variable reluctance actuating portions and thereluctance varies with the distance defined by the gap g, which, ofcourse also varies the flux and force applied to the target. Theattractive force between the electromagnet and the target is defined by:

[0090] F=K(i/g)²

[0091] Where F is the attractive force, measured in Newtons;

[0092] K=an electromagnetic constant which is dependent upon thegeometries of the E-shaped electromagnet, I-shaped target, and number ofconductor turns about the magnet. K=½N² μ_(o)wd; where N=the number ofturns about the E-shaped magnet conductor 81; μ_(o)=a physical constantof about 1.26×10-⁶H/m; w=the half width of the center of the E-shapedcore 80 in meters; and d=the depth of the center of the E-shaped core 80in meters. In a preferred embodiment, K=7.73×10-⁶ kg m³/s²A²;

[0093] i=current, measured in amperes; and

[0094] g=the gap distance, measured in meters.

[0095] Current (not shown) directed through the conductor 81 creates anelectromagnetic field that attracts the I core 82 towards the E core 80.The amount of current determines the amount of attraction. Statedanother way, when the conductor of an electromagnet is energized, theelectromagnet generates a flux that produces an attractive force on thetarget in accordance with the formula given above, thereby functioningas a linear actuating portion. Because the electromagnets can onlyattract the targets, they must be assembled in pairs that can pull inopposition. The targets are fixed to the upper table component 52 andmove relative to the lower table component 54. Opposing pairs ofelectromagnets are secured to the lower table component 54 on oppositesides of the targets. By making a current through the one conductor 81of the pair of electromagnets larger than the current through the otherconductor 81 in the pair, a differential force can be produced thatdraws the target in one direction or its opposing direction.

[0096] Preferably, the targets are attached to the upper table component52 in such a way that the pulling forces of the opposing pair ofelectromagnets do not distort the upper table component 52. This ispreferably accomplished by mounting the targets for an opposing pair ofelectromagnets very close to one another, preferably peripherally of theupper table component 52. It is preferable to extend a thin web 83 ofmaterial (FIG. 5B) that is made of the same material as the upper tablecomponent 52. The opposing electromagnets are mounted on the lower tablecomponent 54 by a predetermined distance, when thin web 83 and targetsare positioned there between, a predetermined gap g is formed betweeneach set of electromagnet and target. With this arrangement, only theresultant force, derived from the sum of the forces produced by the pairof electromagnets and targets, is applied to the upper table component52 via transfer of the force through thin web 83. In this way, opposingforces are not applied to opposite sides of the upper table component 52and stage distortion problems resulting from that type of arrangementare avoided.

[0097]FIG. 5B illustrates a preferred arrangement of the horizontaltable movers 76. In this design, one opposing pair of attraction onlyactuators 79 are mounted so that the attractive forces produced therebyare substantially parallel with the X axis. Two opposing pairs ofattraction only actuators 79 are mounted so that attractive forces fromeach pair are produced substantially parallel with the Y axis. With thisarrangement, the horizontal table movers 76 can make fine adjustments tothe position of the upper table component 52 relative to the lower tablecomponent 54 along the X axis, along the Y axis, and about the Z axis.More specifically, actuation of the single pair of electromagneticactuators 79 aligned along the X axis can achieve fine movements alongthe X axis. Actuation of the two pairs of electromagnetic actuators 79aligned along the Y axis can control fine movements of the upper stagecomponent 52 along the Y axis or in rotation (clockwise orcounterclockwise) in the X-Y plane (i.e., Theta Z control). Y axismovements are accomplished by resultant forces from both pairs that aresubstantially equal and in the same direction. Theta Z movements aregenerally accomplished by producing opposite directional forces from thetwo pairs of electromagnets, although unequal forces in the samedirection will also cause some Theta Z adjustment.

[0098] Alternately, for example, two opposing pairs of electromagneticactuators 79 can be mounted parallel with the Y direction, and oneopposing pair of electromagnetic actuators 79 could be mounted parallelwith the X direction. Other arrangements are also possible, but thepreferred arrangement minimizes the number of actuatingportions/bearings required for the necessary degrees of control.

[0099] Preferably, the lines of force of the electromagnetic actuators79 are arranged to act through the center of gravity of the upper tablecomponent 52. The two Y pairs of electromagnetic actuators 79 arepreferably equidistant from the center of gravity of the upper tablecomponent 52.

[0100] The vertical table movers 78 are used to precisely position theupper table component 52 relative to the lower table component 54 alongthe Z axis, about the X axis, and about the Y axis (collectivelyreferred to as “vertical degrees of freedom”). Because control in thethree vertical degrees of freedom requires less dynamic performance(e.g., acceleration requirements are relatively low), and is easier toaccomplish, lower force requirements exist than in the previouslydescribed X, Y, and Theta Z degrees of freedom. Accordingly, three voicecoil motors can be used as the vertical table movers 78 to adjust theposition of the upper table component 52 in the vertical degrees offreedom. In this design, each motor includes a magnet array 78A attachedto the lower table component 54 and a conductor array 78B attached tothe upper table component 52.

[0101] Preferably, fluid bellows 85 (illustrated in phantom) areutilized to support the dead weight of the upper table component 52. Thefluid bellows 85 prevent overheating of the vertical table movers 78. Asprovided herein, one fluid bellow 85 is preferably positioned next tovertical table mover 78. The bellows 85 have very low stiffness in alldegrees of freedom so they do not significantly interfere with thecontrol of the upper table component 52.

[0102] The guide assembly 50 for each stage 14 is used to move thedevice table 48 along the X axis and about the Z axis and guide themovement of the device table 48 along the Y axis. The design of theguide assembly 50 can be varied to suit the design requirements of thestage assembly 10. In the embodiment illustrated in FIGS. 1-4, the guideassembly 50 includes an upper beam 84, a lower guide 86, a first guideend 88, and a spaced apart second guide end 90.

[0103] The upper beam 84 and the lower guide 86 are spaced apart,substantially parallel, and extend between the guide ends 88, 90.

[0104] The upper beam 84 is somewhat rectangular shaped and defines aportion of the stage mover assembly 16. The upper beam 84 fits withinthe opening 74 of the inner guide section 65. The lower guide 86 issomewhat rectangular shaped and includes a plurality of apertures 92 toreduce the mass. The lower guide 86 also includes a pair of opposedsides 94 (only one side is illustrated in the Figures).

[0105] Pressurized fluid (not shown) is released from the fluid outletsof the section fluid pads 72 towards the opposed sides 94 of the lowerguide 86 to create a fluid bearing between the device table 48 and theguide assembly 50. The fluid bearing maintains the device table 48spaced apart from the guide assembly 50 along the X axis and allows formotion of the device table 48 along the Y axis relative to the guideassembly 50.

[0106] The guide ends 88, 90 secure the upper beam 84 to the lower guide86, and secure a portion of the stage mover assembly 16 to the guideassembly 50. Additionally, each of the guide ends 88, 90 includes aguide fluid pad 96 that is positioned adjacent to the reaction base 42.In this embodiment, each of the guide fluid pads 96 includes a pluralityof spaced apart fluid outlets (not shown), and a plurality of spacedapart fluid inlets (not shown). Pressurized fluid (not shown) isreleased from the fluid outlets towards the reaction base 42 and avacuum is pulled in the fluid inlets to create a vacuum preload type,fluid bearing between each of the guide fluid pads 96 and the reactionbase 42. The vacuum preload type, fluid bearing maintains the guideassembly 50 spaced apart along the Z axis relative to the reaction base42 and allows for motion of the guide assembly 50 along the X axis,along the Y axis, and about the Z axis relative to 30 the reaction base42.

[0107] Alternately, the guide assembly 50 can be supported spaced apartfrom the reaction base 42 by other ways. For example, a magnetic typebearing or a ball bearing type of assembly could be utilized that allowsfor motion of the guide assembly 50 relative to the reaction base 42.

[0108] The components of each stage 14 can be made of a number ofmaterials including ceramic, such as alumina or silicon carbide; metalssuch as aluminum; composite materials; or plastic.

[0109] The stage mover assembly 16 controls and moves each stage 14relative to the stage base 12. The design of the stage mover assembly 16and the movement of the stages 14 can be varied to suit the movementrequirements of the stage assembly 10. In the embodiment illustrated inFIGS. 1-3, the stage mover assembly 16 moves the stage 14 with arelatively large displacement along the X axis, a relatively largedisplacement along the Y axis, and a limited 10 displacement about the Zaxis (theta Z) relative to the stage base 12. In this embodiment, thestage mover assembly 16 includes: (i) a first X stage mover 98, (ii) asecond X stage mover 100, (iii) an upper Y guide mover 102, (iv) a lowerY guide mover 104, and (v) a Y stage mover 106. The X stage movers 98,100 move the stage 14 along the X axis and about the Z axis. The Y stagemovers 102, 104, 106 move the guide assembly 50 and the stage 14 alongthe Y axis. More specifically, in this embodiment, (i) the X stagemovers 98, 100 move the guide assembly 50 with a relatively largedisplacement along the X axis and with a limited range of motion aboutthe Z axis (theta Z), (ii) the Y guide movers 102, 104 move the guideassembly 50 with a small displacement along the Y axis, and (iii) the Ystage mover 106 moves the device table 48 with a relatively largedisplacement along the Y axis.

[0110] The design of each mover 98, 100, 102, 104, 106 can be varied tosuit the movement requirements of the stage assembly 10. As providedherein, each mover 98, 100, 102, 104, 106 includes a first component 108and an adjacent second component 110, which interact with the firstcomponent 108. In the embodiments provided herein, each of the Y guidemovers 102, 104 is an E/I core type actuator. Further, in theembodiments provided herein, for the X stage movers 98, 100 and the Ystage mover 106, one of the components 108, 110 includes one or moremagnet arrays (not shown) and the other component 108, 110 includes oneor more conductor arrays (not shown).

[0111] Each magnet array includes one or more magnets (not shown). Thedesign of each magnet array and the number of magnets in each magnetarray can be varied to suit the design requirements of the movers 98,100, 106. Each magnet can be made of a permanent magnetic material suchas NdFeB.

[0112] Each conductor array includes one or more conductors (not shown).The design of each conductor array and the number of conductors in eachconductor array is varied to suit the design requirements of the movers98, 100, 106. Each conductor can be made of metal such as copper or anysubstance or material responsive to electrical current and capable ofcreating a magnetic field such as superconductors.

[0113] Electrical current (not shown) is individually supplied to eachconductor in each conductor array by the control system 22. For eachmover 98, 100, 106, the electrical current in each conductor interactswith a magnetic field (not shown) generated by one or more of themagnets in the magnet array. This causes a force (Lorentz force) betweenthe conductors and the magnets that can be used to move the stage 14relative to the stage base 12.

[0114] Specifically, the first component 108 and the second component110 of each X stage mover 98, 100 interact to selectively move the stage14 along the X axis and about the Z axis relative to the stage base 12.In the embodiment illustrated in the FIG. 1, each X stage mover 98, 100is a commutated, linear motor.

[0115] The first component 108 for the first X stage mover 98 is securedto a first X reaction mass 112 of the X reaction component 33A of thereaction mass assembly 18 while the second component 110 of the first Xstage mover 98 is secured to the first guide end 88 of the guideassembly 50. Similarly, the first component 108 for the second X stagemover 100 is secured to a second X reaction mass 114 of the X reactioncomponent 33A of the reaction mass assembly 18 while the secondcomponent 110 of the second X stage mover 100 is secured to the secondguide end 90 of the guide assembly 50. In this embodiment, the firstcomponent 108 of each X stage mover 98, 100 includes a conductor array(not shown) while the second component 110 of each X stage mover 98, 100includes a pair of spaced apart magnet arrays (not shown). Alternately,for example, the first component 108 of each X stage mover 98, 100 caninclude a magnet array (not shown) while the second component 110 ofeach X stage mover 98, 100 can include a pair of spaced apart conductorarrays (not shown).

[0116] It should be noted that the first X stage mover 98 for each ofthe stages 14 illustrated in the FIGS. 1-3 share the same firstcomponent 108. Similarly, the second X stage mover 100 for each of thetwo stages 14 illustrated in the FIGS. 1-3 share the same firstcomponent 108.

[0117] With the design provided herein, the X stage movers 98, 100 makerelatively large displacement adjustments to the position of the guideassembly 50 along the X axis. The required stroke of the X stage movers98, 100 along the X axis will vary according to desired use of the stageassembly 10. More specifically, for an exposure apparatus 30, generally,the stroke of the X stage movers 98, 100 for moving the semiconductorwafer 28 is between approximately two hundred (200) millimeters and onethousand (1000) millimeters.

[0118] The X stage movers 98, 100 also make relatively slightadjustments to position of each stage 14 about the Z axis. In order tomake the adjustments about the Z axis, the second component 110 of oneof the X stage movers 98, 100 is moved relative to the second component110 of the other X stage mover 98, 100. With this design, the X stagemovers 98, 100 generate torque about the Z axis. A gap (not shown)exists between the first component 108 and the second component 110 ofeach X stage mover 98, 100 to allow for slight movement of each stage 14about the Z axis. Typically, the gap is between approximately onemillimeter and five millimeters. However, depending upon the design ofthe particular mover, a larger or smaller gap may be utilized.

[0119] The Y guide movers 102, 104 selectively move the guide assembly50 along the Y axis relative to the stage base 12. In the embodimentillustrated in FIGS. 1-3, each Y guide mover 102, 104 includes anopposed pair of electromagnetic actuators. The electromagnetic actuatorsconsume less power and generate less heat than a voice coil motor or alinear motor. Suitable 25 electromagnetic actuators include the E/I coreactuators 214 described above and illustrated in FIGS. 6A and 6B.

[0120] In the embodiments provided herein: (i) the combination E shapedcore and conductor of each electromagnetic actuator is considered thesecond component 110 of each Y guide mover 102, 104 and is secured tothe guide assembly 50, and (ii) the I shaped core of eachelectromagnetic actuator is considered the first component 108 of each Yguide mover 102, 104 and is secured to the second X reaction mass 114 ofthe reaction mass assembly 18. In this embodiment, each Y guide mover102, 104 includes two E core and conductor combinations that areseparated by a row of I cores.

[0121] It should be noted that the upper Y guide mover 102 for each ofthe stages 14 illustrated in the FIGS. 1-3 share the same firstcomponent 108. Similarly, the lower Y guide mover 104 for each of thetwo stages 14 illustrated in the FIGS. 1-3 share the same firstcomponent 108.

[0122] The Y stage mover 106 moves the stage 14 with a relatively largedisplacement along the Y axis relative to the stage base 12. Morespecifically, the first component 108 and the second component 110 ofthe Y stage mover 106 interact to selectively move the device table 48along the Y axis relative to the guide assembly 50. In the embodimentillustrated in the FIGS. 1-3, the Y stage mover 106 is a commutated,linear motor. The first component 108 for the Y stage mover 106 issecured to the upper beam 84 of the guide assembly 50, and the secondcomponent (not shown) is secured to the inner guide section 65 of thedevice table 48. In this embodiment, the first component 108 of the Ystage mover 106 includes a conductor array (not shown) and the secondcomponent 110 of the Y stage mover 106 includes a magnet array (notshown). Alternately, for example, the first component 108 of the Y stagemover 106 could include a magnet array (not shown) while the secondcomponent 110 of the Y stage mover 106 could include a conductor array(not shown).

[0123] With this design, the Y stage mover 106 makes relatively largedisplacement adjustments to the position of the device table 48 alongthe Y axis. The required stroke of the Y stage mover 106 along the Yaxis will vary according to desired use of the stage assembly 10. Morespecifically, for an exposure apparatus 30, generally, the stroke of theY stage mover 106 for moving the semiconductor wafer 28 is betweenapproximately one hundred (100) millimeters and six hundred (600)millimeters.

[0124] The reaction mass assembly 18 reduces and minimizes the amount ofreaction forces from the stage movers 98, 100, 102, 104, 106 that istransferred to the stage base 12 and to the mounting base 24. Uniquely,the reaction mass assembly 18 provided herein is free to move with atleast two, and more preferably three, degrees of freedom. Morespecifically, the reaction mass assembly 18 is free to move along the Xaxis, along the Y axis, and about the Z axis relative to the stage base12. This design allows the reaction mass assembly 18 to reduce andminimize the amount of reaction forces from the stage movers 98, 100,102, 104, 106 that is transferred to the stage base 12 and to themounting base 24. Further, the reaction mass assembly 18 provided hereinreduces and minimizes the reaction forces for multiple stages 14.

[0125] The design of the reaction mass assembly 18 can be varied to suitthe design requirements of the stage assembly 10. In the embodimentillustrated in FIGS. 1-3, the reaction mass assembly 18 includes the Yreaction component 33B, the X reaction component 33A, and a reactionmover assembly 124. In this design, the Y reaction component 33Bincludes the reaction base 42, and the X reaction component 33A includesthe first X reaction mass 112, and the second X reaction mass 114.Further, the reaction mass assembly 18 is supported above the stage base12 by the fluid bearings as provided above.

[0126] As an overview, through the principle of conservation ofmomentum, movement of each stage 14 with the X stage movers 98, 100along the X axis in one direction, moves the X reaction masses 112, 114of the reaction mass assembly 18 in the opposite direction along the Xaxis. Somewhat similarly, movement of each stage 14 with the Y stagemovers 102, 104, 106 along the Y axis in one direction, moves the Xreaction masses 112, 114 and the reaction base 42 along the Y axis inthe opposite direction. With this design, the reaction forces from thestage mover assembly 16 are negated. This inhibits the reaction forcesfrom the stage mover assembly 16 from influencing the position of thestage base 12.

[0127] The reaction base 42 supports each stage 14 and the X reactionmasses 112, 114. The design of the reaction base 42 can be varied tosuit the design requirements of the stage assembly 10. In the embodimentillustrated in FIGS. 1-3, the reaction base 42 is generally rectangularshaped and includes a planar, upper surface 126, a planar bottom surface128, and four sides 130.

[0128] The reaction base 42 also includes a mass guide assembly 131 thatguides the X reaction masses 112, 114, and allow the X reaction masses112, 114 to move relative to the reaction base 42 along the X axis. Inthe embodiments provided herein, the reaction base 42 includes a pair ofbase guides 132. Each base guide 132 is a rectangular shaped channel inthe upper surface 126 that extends along the X axis. Pressurized fluidis released into the channel and a vacuum is created between thereaction base 42 and each of the X reaction masses 112, 114 to create avacuum preload type fluid bearing (not shown). The fluid bearingmaintains the X reaction masses 112, 114 spaced apart from the reactionbase 42, and allows for independent motion of the X reaction masses 112,114 along the X axis relative to the reaction base 42. Alternately, theX reaction masses 112, 114 can be supported above the reaction base 42by other ways such as magnetic type bearing (not shown) or a ballbearing type of 5 assembly (not shown).

[0129] It should be noted in this embodiment, that the X reaction masses112, 114 and the reaction base 42 move concurrently along the Y axis andabout the Z axis. Stated another way, the X reaction masses 112, 114 arerigidly coupled along the Y axis.

[0130] Referring to FIGS. 1-3, each of the X reaction masses 112, 114includes a mass top 134, a mass bottom 136, a mass outer side 138, and amass inner side 140. Each of the X reaction masses 112, 114 alsoincludes a mass follower 142 that interacts with one the base guides 132in the reaction base 42 to allow for movement of each X reaction mass112, 114 along the X axis. In the embodiment illustrated in FIGS. 1-3,the mass follower 142 is a rectangular shaped body that extends downwardfrom the mass bottom 136 of each X reaction mass 112, 114.

[0131] The first X reaction mass 112 is generally rectangular shaped andincludes a somewhat rectangular shaped first channel 144 that extendsinto the mass inner side 140 of the first X reaction mass 112. In thisembodiment, the first component 108 of the first X stage mover 98 ispositioned within the first channel 144 and secured to the first Xreaction mass 112.

[0132] The second X reaction mass 114 is somewhat rectangular shaped andincludes a rectangular shaped upper groove 146 in the mass top 134 and asomewhat rectangular shaped second channel 148 that extends into themass inner side 140 of the second X reaction mass 114. In thisembodiment, the first component 108 of the upper Y guide mover 102 ispositioned within the upper groove 146 and is secured to the second Xreaction mass 114. Additionally, the first component 108 of the second Xstage mover 100 and the first component (not shown) of the lower Y guidemover 104 are positioned within the second channel 148 and are securedto the second X reaction mass 114.

[0133] Additionally, each of the X reaction masses 112, 114 includes an“L” shaped bracket 150 that is secured to the mass outer side 138. Eachbracket 150 is used to secure a portion of the reaction mover assembly124 to the X reaction masses 112, 114.

[0134] The reaction mover assembly 124 makes minor corrections (i) tothe position of the X reaction masses 112, 114 relative to the reactionbase 42 and (ii) to the position of the reaction mass assembly 18relative to the stage base 12. As provided herein, the reaction moverassembly 124 can adjust the position of the reaction mass assembly 18relative to the stage base 12 in one degree of freedom, and morepreferably, in three degrees of freedom. For example, the reaction moverassembly 124 can: (i) move the X reaction component 33A relative to theY reaction component 33B along the X axis, (ii) move the X reactioncomponent 33A and the Y reaction component 33B concurrently relative tothe stage base 12 along the Y axis, (iii) move the X reaction component33A and the Y reaction component 33B concurrently relative to the stagebase 12 along the X axis, and/or (iv) move the X reaction component 33Aand the Y reaction component 33B concurrently relative to the stage base12 about the Z axis.

[0135] In the embodiment illustrated in FIGS. 1-3, the reaction moverassembly 124 is used to make minor corrections along the X axis, alongthe Y axis, and about the Z axis to the position of the reaction massassembly 18 relative to the stage base 12. Further, the reaction moverassembly 124 is used to 20 independently correct the position of the Xreaction masses 112, 114 along the X axis relative to the reaction base42.

[0136] The design of the reaction mover assembly 124 can be variedaccording to the design requirements of the stage assembly 10. Forexample, the reaction mover assembly 124 can include one or more rotarymotors, voice coil motors, 25 linear motors, electromagnetic actuators,and/or force actuators. In the embodiment illustrated in the FIGS. 1-3,the reaction mover assembly 124 includes a first upper X reaction mover152A, a second upper X reaction mover 152B, a pair of lower X reactionmovers 154, and a Y reaction mover 156. Alternately, for example, thereaction mover assembly 124 could include a single, 30 lower X reactionmover and a pair of Y reaction movers.

[0137] In the embodiments illustrated in FIGS. 1-3, each reaction mover152, 154, 156 includes a first component 158, and an adjacent secondcomponent 160. In the embodiments provided herein, one of the components158, 160 of each mover 152, 154, 156 includes one or more magnet arrays(not shown) and the other component 158, 160 of each mover 152, 154, 156includes one or more conductor arrays (not shown). Electrical current(not shown) is individually supplied to each conductor array by thecontrol system 22. For each reaction mover 152, 154, 156, the electricalcurrent in each conductor interacts with a magnetic field (not shown)generated by one or more of the magnets in the magnet array. This causesa force (Lorentz force) between the conductors and the magnets.

[0138] Specifically, the first component 158 and the second component160 of each upper X reaction mover 152 interact to selectively andindependently move one of the X reaction masses 112, 114 along the Xaxis relative to the reaction base 42. In the embodiment illustrated inthe FIG. 1, each upper X reaction mover 152 is a commutated, linearmotor. For the first upper X reaction mover 152A, the first component158 is secured to the first X reaction mass 112, while the secondcomponent 160 is secured to the reaction base 42. Similarly, for thesecond upper X reaction mover 1528, the first component 158 is securedto the second X reaction mass 114, while the second component 160 issecured to the reaction base 42.

[0139] In this embodiment, the first component 158 of each upper Xreaction mover 152 includes a conductor array (not shown), while thesecond component 160 of each upper X reaction mover 152 includes a pairof spaced apart magnet arrays (not shown). With this design, the upper Xreaction movers 152 can independently make corrections to the positionsof the X reaction masses 112, 114 along the X axis relative to thereaction base 42. Alternately, for example, the first component of eachupper X reaction mover 152 could include a pair of spaced apart magnetarrays while the second component of each upper X reaction mover 152could include a conductor array.

[0140] Preferably, the upper X reaction movers 152 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the X reaction masses 112, 114 relative to thereaction base 42 along 30 the X axis.

[0141] Somewhat similarly, the first component 158 and the secondcomponent 160 of each lower X reaction mover 154 interact tocollectively move the reaction base 42 along the X axis relative to thestage base 12, and to rotate the reaction base 42 and the X reactionmasses 112, 114 about the Z axis relative to the stage base 12. In theembodiment illustrated in the FIG. 1, each lower X reaction mover 154 isa commutated, linear motor. For each of the lower X reaction movers 154,the first component 158 is secured to the reaction base 42 while thesecond component 160 is secured to the mounting base 24 with a groundframe 164 (illustrated in FIG. 18). Alternately, for example, the secondcomponent 160 of each lower X reaction mover 154 can be secured to thestage base 12.

[0142] In this embodiment, the first component 158 of each lower Xreaction mover 154 includes a conductor array (not shown), while thesecond component 160 of each lower X reaction mover 154 includes a pairof spaced apart magnet arrays (not shown). With this design, the lower Xreaction movers 154 can make minor corrections to the positions of thereaction base 42 along the X axis relative to the stage base 12, and torotate the reaction base 42 and the X reaction masses 112, 114 about theZ axis relative to the stage base 12. Alternately, for example, thefirst component 158 of each lower X reaction mover 154 could include apair of spaced apart magnet arrays while the second component 160 ofeach upper X reaction mover 154 could include a conductor array.

[0143] Preferably, the lower X reaction movers 154 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the reaction base 42 relative to the stagebase 12 along the X axis and 20 about the Z axis.

[0144] Similarly, the first component 158 and the second component 160of the Y reaction mover 156 interact to selectively move the reactionbase 42 and the X reaction masses 112, 114 concurrently along the Y axisrelative to the stage base 12. In the embodiment illustrated in FIG. 1,the Y reaction mover 156 is a commutated, linear motor. For the Yreaction mover 156, the first component 158 is secured to the reactionbase 42 while the second component 160 is secured to the mounting base24 with the ground frame 164 (illustrated in FIG. 18). Alternately, forexample, the second component 160 of each Y reaction mover 156 can besecured to the stage base 12.

[0145] In this embodiment, the first component 158 of each Y reactionmover 156 includes a conductor array while the second component 160 ofeach Y reaction mover 156 includes a pair of spaced apart magnet arrays(not shown). With this design, the Y reaction movers 156 can make minorcorrections to the position of the reaction base 42 and the X reactionmasses 112, 114 along the Y axis relative to the stage base 12.Alternately, for example, the first component of the Y reaction mover156 could include a pair of spaced apart magnet arrays while the secondcomponent of the Y reaction mover 156 could include a conductor array.

[0146] Preferably, the Y reaction mover 156 includes a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the reaction base 42 relative to the stagebase 12 along the Y axis.

[0147] For each of the embodiments provided herein, the ratio of themass of the reaction mass assembly 18 to the mass stage 14 is preferablyrelatively high. This will minimize the movement of the reaction massassembly 18 and minimize the required travel of the reaction movers 152,154, 156. A suitable ratio of the mass of the reaction mass assembly 18to the mass of the stage 14 is between approximately 1:2 and 1:10. Alarger mass ratio is better, but is limited by the physical size of thereaction mass assembly 18.

[0148] Preferably, each of the movers in the stage mover assembly 16 andthe reaction mover assembly 124, are at the same height along the Zaxis. In the X axis, the Y stage mover 106, a center of gravity of thedevice table 48, and a center of gravity of the guide assembly 50 arepreferably in line. Also, in the X axis, the Y reaction mover 156 andthe center of gravity of the Y reaction component 33B are preferably inline. In the Y axis, the center of gravity of the device table 48 andthe fluid bearing between the device table 48 and the guide assembly 50are preferably in line. In the Y axis, the center of gravity of thefirst X reaction mass 112, the first X stage mover 98, and the firstupper reaction mover 152A are preferably in line. In the Y axis, thecenter of gravity of the second X reaction mass 114, the second X stagemover 100, and the second upper X reaction mover 152 are preferably inline.

[0149] The measurement system 20 monitors movement of each stage 14relative to the stage base 12, or to some other reference such as a lensassembly 508 (illustrated in FIG. 18). With this information, the stagemover assembly 16 can be used to precisely position of the stages 14.The design of the measurement system 20 can be varied. For example, themeasurement system 20 can utilize laser interferometers, encoders,and/or other measuring devices to monitor the position of the stages 14.

[0150] In the embodiment illustrated in FIGS. 1-3, the measurementsystem 20 monitors the position of the device table 48 for each stage 14along the X axis, along the Y axis, and about the Z axis. For the designillustrated in FIGS. 1-3, for each stage 14, the measurement system 20measures the position of the device table 48 relative to the guideassembly 50 along the Y axis, and the measurement system 20 measures theposition of the device table 48 along the Y axis, along the X axis, andabout the Z axis relative to the lens assembly 508.

[0151] In this embodiment, for each stage 14, the measurement system 20utilizes a linear encoder (not shown) that measures the amount ofmovement of device table 48 relative to the guide assembly 50 as thedevice table 48 moves relative to the guide assembly 50. Alternately,for example, an interferometer system (not shown) can be utilized. Asuitable interferometer system can be made with components obtained fromAgilent Technologies in Palo Alto, Calif.

[0152] Additionally, for each stage 14, the measurement system 20includes an XZ interferometer 170 and a Y interferometer 172. The XZinterferometer 170 includes an XZ mirror 174 and an XZ block 176. The XZblock 176 interacts with the XZ mirror 174 to monitor the location ofthe device table 48 along the X axis and about the Z axis (theta Z).More specifically, the XZ block 176 generates a pair of spaced apart XZmeasurement laser beams (not shown) that are reflected off of the XZmirror 174. With these laser beams, the location of the device table 48along the X axis and about the Z axis can be monitored. Further, becausethe device table 48 does not move relative to the guide assembly 50along the X axis or about the Z axis, the location of the guide assembly50 along the X axis and about the Z axis can also be monitored by the XZinterferometer 170.

[0153] In the embodiment illustrated in the Figures, the XZ mirror 174is rectangular shaped and extends along one side of the device table 48.The XZ block 176 is positioned away from the device table 48. The XZblock 176 can be secured to the apparatus frame 46 (illustrated in FIG.18) or some other location that is isolated from vibration.

[0154] Somewhat similarly, the Y interferometer 172 includes a Y mirror178 and a Y block 180. The Y mirror 178 interacts with the Y block 180to monitor the position of the device table 48 along the Y axis. Morespecifically, the Y block 180 generates a Y measurement laser beam thatis reflected off of the Y mirror 178. With this laser beam, the locationof the device table 48 along the Y axis can be monitored. Further,because the position of the device table 48 relative to the guideassembly 50 along the Y axis is measured with the encoder, the positionof the guide assembly 50 along the Y axis can also be monitored.

[0155] In the embodiment illustrated in the Figures, the Y mirror 178 isrectangular shaped and is positioned along one of the sides of thedevice table 48. The Y block 180 is positioned away from the devicetable 48. The Y block 180 can be secured to the apparatus frame 46(illustrated in FIG. 18) or some other location that is isolated fromvibration.

[0156] Additionally, for the embodiment illustrated in FIGS. 5A and 5B,the measurement system 20 includes one or more sensors (not shown) thatmeasure the position of the upper table component 52 relative to thelower table component 54.

[0157] The control system 22 controls the stage mover assembly 16 foreach stage 14 to precisely position the stages 14 and the devices 26. Inthe embodiment illustrated in FIGS. 1-3, the control system 22 directsand controls the current to the conductor array for each of the X stagemover 98, 100 to control movement of the stages 14 along the X axis andabout the Z axis. Similarly, the control system 22 directs and controlsthe current to conductor array for the Y stage mover 106 to controlmovement of the stages 14 along the Y axis. Also, the control system 22directs and controls the current to the conductors of each E/I coreactuator of each Y guide mover 102, 104 to control the position of theguide assembly 50.

[0158] Additionally, the control system 22 directs and controls currentto the reaction mover assembly 124 to control the position of thereaction mass assembly 18 along the X axis, along the Y axis and aboutthe Z axis. More 25 specifically, the control system 22 directs currentto the conductor array for each upper X reaction mover 152 toindependently control the position of each X reaction mass 112, 114relative to the reaction base 42. Further, the control system 22 directscurrent to the conductor array for each lower X reaction mover 154 andthe Y reaction mover 156 to control the position of the reaction base 42along the X axis, along the Y axis and about the Z axis relative to thestage base 12.

[0159]FIGS. 7A and 7B illustrate simplified schematic top views of aportion of a stage assembly 10 having a single stage 14 that facilitatea discussion of the movement of the reaction mass assembly 18. Inparticular, FIG. 7A illustrates the stage assembly 10 with one devicetable 48 positioned approximately half-way between the X reaction masses112, 114 along the Y axis. In FIG. 7A, the device table 48 is positionednear a stage assembly combined center of gravity 182 and a stage centerof gravity 184. In this embodiment, the stage assembly combined centerof gravity 182 represents the center of gravity of the device table 48,the guide assembly 50, the first X reaction mass 112, the second Xreaction mass 114, and the reaction base 42 and the stage center ofgravity 184 represents the center of gravity of the device table 48 andthe guide assembly 50. FIG. 7B illustrates the stage assembly 10 withthe guide assembly 50, device table 48, and the stage center of gravity184 positioned away from the stage assembly combined center of gravity182.

[0160] The following symbols are used in conjunction with FIGS. 7A and7B and the discussion provided below to describe the movement of thereaction mass assembly 18:

[0161] L_(y1), represents the distance along the Y axis between thecenter of the first X reaction mass 112 and a stage combined center ofgravity 184.

[0162] L_(y2) represents the distance along the Y axis between thecenter of the second X reaction mass 114 and the stage combined centerof gravity 184.

[0163] L_(yt) represents the distance along the Y axis between thecenter of the first X reaction mass 112 and the center of the second Xreaction mass 114.

[0164] L_(X) represents the distance along the X axis between the stageassembly combined center of gravity 182 and the stage combined center ofgravity 184.

[0165] M_(s) represents the total mass of the stage 14.

[0166] M₁ represents the total mass of the first X reaction mass 112.

[0167] M₂ represents the total mass of the second X reaction mass 114.

[0168] M_(d) represents the total mass of the device table 48.

[0169] M_(cm) represents the combined mass of the X reaction masses 112,114 the reaction base 42 and the guide assembly 50.

[0170] a^(X) _(s), represents the acceleration of the stage 14 along theX axis.

[0171] a^(X) ₁, represents the acceleration of the first X reaction mass112 along the X axis.

[0172] a^(X) ₂ represents the acceleration of the second X reaction mass114 along the X axis.

[0173] a^(Y) _(d) represents the acceleration of the device table 48along the Y axis.

[0174] a^(Y) _(cm) represents the acceleration of the X reaction masses112, 114, the reaction base 42, and the guide assembly 50 along the Yaxis.

[0175] Referring to FIG. 7A, during a move of the stage 14 along the Xaxis, under the principles of the conservation of momentum, thefollowing formulas are applicable:

Ms∫a ^(X) _(s) dt+M ₁ ∫a ^(X) ₁ dt+M ₂ ∫a ^(X) ₂ dt=constant=0

M ₁ a ₁ L _(y1) =M ₂ a ₂ L _(y2)

[0176] Referring to FIG. 7B, during a move of the stage 14 along the Yaxis, under the principles of conservation of momentum, the followingformulas are applicable:

M _(d) ∫a ^(Y) _(d) dt+M _(cm) ∫a ^(Y) _(cm) dt=constant=0

[0177] Further, to achieve zero torque:

M _(d) a ^(Y) _(d) L _(X)=(M ₂ a ^(X) ₂ −M ₁ a ₁ ^(X))L _(yt)

[0178] Further, to achieve no net force

M ₁ a ₁ ^(X) +M ₂ a ₂ ^(X)=0

[0179]FIG. 7C is a schematic that describes the sensing and controlfunctions used to move and control a stage assembly 10 that includes thedevice table 48 illustrated in FIGS. 5A and 5B. The sensing and controlfunctions are more thoroughly described in co-pending U.S. patentapplications Ser. Nos. 09/022,713 field Feb. 12, 1998, 09/139,954 filedAug. 25, 1998, and 09/141,762 filed Aug. 27, 1998, each of which ishereby incorporated by reference thereto, in their entireties. Atrajectory 190, or desired path for the focused optical system tofollow, is determined based on the desired path of the wafer or otherobject to which the focused optical system is to be applied. Thetrajectory 190 is next fed into the control system 22. The trajectory190 is compared with a sensor signal vector S that is generated from theoutput of measurement system 20. The difference vector, which resultsfrom the comparison, is transformed to a CG coordinate frame though aninverse transformation 192. The control law 193 prescribes thecorrective action for the signal. The control law may be in the form ofa PID (proportional integral derivative) controller, proportional gaincontroller or preferably a lead-lag filter, or other commonly known lawin the art of control, for example.

[0180] The vector for vertical motion is fed to the CG to VCMtransformation 194. This transforms the CG signal to a value of force tobe generated by the VCMs, which is then fed to the VCM gain 195, andoutput to the stage hardware 196. The vector for planar motion is fed tothe CG to El-core transformation 197. This transforms the CG signal to aforce to be generated by the El-core force (i.e., electromagnet andtarget arrangements). Because the El-core force depends upon the gapsquared, it is compensated by the short range sensor vector g throughthe compensation block 198, to produce a linear output to the stagehardware 196. The stage hardware 196 responds to the input and ismeasured in the sensor frame S. A similar servo loop (block 199) is notshown in detail for moving the lower table component 54. The position oflower table component 54, is also computed using the upper tablecomponent 52 and the gap g. As provided herein, the lower tablecomponent 54 is servoed to maintain a predetermined relationship to theupper table component 52.

[0181] FIGS. 8-10 illustrate a second embodiment having features of thepresent invention. In particular, FIG. 8 illustrates a perspective viewof the stage assembly 10, FIG. 9 illustrates a top plan view of thestage assembly 10 of FIG. 8, and FIG. 10 illustrates an explodedperspective view of the reaction mass assembly 18. The stage assembly 10illustrated in FIGS. 8 and 9 includes the stage base 12, a pair ofstages 14, the stage mover assembly 16, the reaction mass assembly 18,the measurement system 20, and the control system 22.

[0182] In the embodiment illustrated in FIGS. 8-9, each stage 14, thestage mover assembly 16, the measurement system 20, and the controlsystem 22 are somewhat similar to the equivalent components describedabove. However, in the embodiment illustrated in FIGS. 8-10, the stagebase 12 and the reaction mass assembly 18 differ from the embodimentillustrated in FIGS. 1-3.

[0183] In the embodiment illustrated in FIGS. 8-10, the X reactioncomponent 33A includes the X reaction masses 112, 114. However, in thisembodiment, instead of a reaction base 42, the Y reaction component 33Bincludes a first Y reaction mass 200 and a second Y reaction mass 202.

[0184] Further, in this embodiment, the base top 34 of the stage base 12includes a reaction guide assembly 203, e.g. a pair of reaction guides204. Each Y reaction mass 200, 202 includes a Y follower 205. Thereaction guides 204 cooperate with the Y followers 205 to guide movementof the Y reaction masses 200, 202 along the Y axis and allow thereaction masses 112, 114, 200, 202 to move relative to the stage base 12along the Y axis. In the embodiments provided herein, each reactionguide 204 is a rectangular shaped channel in the base top 34 thatextends along the Y axis, and each Y follower 205 is a rectangularshaped lip that extends below each Y reaction mass 200, 202 along the Yaxis. Pressurized fluid is released into the channel and a vacuum iscreated between the stage base 12 and each of the Y reaction masses 200,202 to create a vacuum preload type fluid bearing (not shown). The fluidbearing maintains the Y reaction masses 200, 202 spaced apart from thestage base 12 and allows for relative motion of the reaction masses 112,114, 200, 202 along the Y axis relative to the stage base 12.Alternately, the Y reaction masses 200, 202 can be supported above thestage base 12 by other ways such as magnetic type bearing (not shown) ora ball bearing type assembly (not shown).

[0185] In this embodiment, the X reaction masses 112, 114 moveindependently relative to the Y reaction masses 200, 202 along the Xaxis. Further, all of the reaction masses 112, 114, 200, 202 movetogether along the Y axis. Stated another way, the X reaction masses112, 114 are rigidly coupled in the Y direction and move concurrentlywith the Y reaction masses 200, 202 along the Y axis.

[0186] As can best be seen with reference to FIG. 10, each X reactionmass 112, 114 includes a pair of opposed ends 206. Each end 206 includesan X follower 208. In this embodiment, each X follower 208 is a notch inthe end of the X reaction mass 112, 114. Each of the Y reaction masses200, 202 includes two X guides 210. In this embodiment, each X guide 210is a groove that is sized and shaped to receive a portion of one of theX reaction masses 112, 114. The X guides 210 and the X followers 208cooperate to form the mass guide assembly 131. More specifically, the Xguides 210 cooperate with the X followers 208, and allow the X reactionmasses 112, 114 to move relative to the Y reaction masses 200, 202 alongthe X axis. Further, the X guides 210 cooperate with the X followers 208to constraint the X reaction masses 112, 114 so that the X reactionmasses 112, 114 move concurrently with the Y reaction masses 200, 202along the Y axis.

[0187] In the design, pressurized fluid is released into each X guide210 and a vacuum is created between each Y reaction mass 200, 202 andeach of the X reaction masses 112, 114 to create a vacuum preload typefluid bearing (not shown). The fluid bearing maintains the X reactionmasses 112, 114 spaced apart from the Y reaction masses 200, 202 andallows for relative motion of the X reaction masses 112, 114independently along the X axis relative to the Y reaction masses 200,202. Alternately, for example, the X reaction masses 112, 114 can besupported and allowed to move relative to the Y reaction masses 200, 202by other ways, such as a magnetic type bearing (not shown) or a ballbearing type assembly (not shown).

[0188] Somewhat similar to the embodiment illustrated in FIGS. 1-3, inthe embodiment illustrated in FIGS. 8-10, the first component 108 of thefirst X stage mover 98 is secured to and moves with the first X reactionmass 112. Additionally, the first component 108 of the second X stagemover 100 is secured to and moves with the second X reaction mass 114.Further, the first component 108 of the Y stage mover 106 is secured tothe guide assembly 50, and the second component 110 is secured to thedevice table 48. However, in the embodiment illustrated in FIGS. 8-10,each stage 14 utilizes a single Y guide mover 212 to move the guideassembly 50 along the Y axis relative to the stage base 12. In theembodiment illustrated in FIGS. 8-10, the Y guide mover 212 is a pair ofE/I core actuators 214.

[0189] In this embodiment, the reaction mover assembly 124 is again usedto make minor corrections along the Y axis to the position of thereaction mass assembly 18 relative to the stage base 12. Further, thereaction mover assembly 124 is used to make minor corrections to theposition of the X reaction masses 112, 114 along the X axis relative tothe Y reaction masses 200, 202 and the stage base 12.

[0190] In the embodiment illustrated in FIGS. 8-10, the reaction moverassembly 124 includes a pair of X reaction movers 220 and a pair of Yreaction movers 222 that cooperate to correct the location of thereaction mass assembly 18 relative to the stage base 12. In theembodiment illustrated in FIGS. 8-10, each of the reaction movers 220,222 includes a first component 224 and an adjacent, second component226. In the embodiments provided herein, one of the components 224, 226of each of the reaction movers 220, 222 includes one or more magnetarrays (not shown) and the other component 224, 226 of each of thereaction movers 220, 222 includes one or more conductor arrays (notshown).

[0191] Electrical current (not shown) is individually supplied to eachconductor array by the control system 22.

[0192] For each of the reaction movers 220, 222, the electrical currentin each conductor interacts with a magnetic field (not shown) generatedby one or more of the magnets in the magnet array. This causes a force(Lorentz force) between the conductors and the magnets.

[0193] Specifically, the first component 224 and the second component226 of each X reaction mover 220 interact to independently move one ofthe X reaction masses 112, 114 along the X axis relative to the Yreaction masses 200, 202. In the embodiment illustrated in the FIGS.8-10, each X reaction mover 220 is a commutated, linear motor. For oneof the X reaction movers 220, the first component 224 is secured to thefirst X reaction mass 112 while the second component 226 is secured toeither or both of the Y masses 200, 202. Similarly, for the other Xreaction mover 220, the first component 224 is secured to the second Xreaction mass 114 while the second component 226 is secured to either orboth of the Y masses 200, 202.

[0194] In the embodiment illustrated in FIGS. 8-10, a first connectorbracket 228 and a spaced apart second connector bracket 230 each extendbetween the Y masses 200, 202. The connector brackets 228, 230 move withthe Y masses 200, 202 above the stage base 12. The first connectorbracket 228 extends along the first X reaction mass 112 and the secondconnector bracket 230 extends along the second X reaction mass 114. Inthis embodiment, the second component 226 of each of the X reactionmovers 220 is secured to the connector brackets 228, 230.

[0195] In FIGS. 8-10, the first component 224 of each X reaction mover220 includes a pair of spaced apart magnet arrays (not shown), while thesecond component 226 of each X reaction mover 220 includes a conductorarray (not shown). With this desigh, the X reaction movers 220 canindependently make corrections to the positions of the X reaction masses112, 114 along the X axis relative to the stage base 12. Alternately,for example, the first component of each X reaction mover could includea conductor array while the second component of each X reaction movercould include a pair of spaced apart magnet arrays.

[0196] Preferably, the X reaction movers 220 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the X reaction masses 112, 114 relative to thestage base 12 or the Y masses 200, 202 along the X axis.

[0197] Somewhat similarly, the first component 224 and the secondcomponent 226 of each Y reaction mover 222 interact to selectively movethe reaction masses 112, 114, 200, 202 along the Y axis relative to thestage base 12. In the embodiment illustrated in FIGS. 8-10, each Yreaction mover 222 is a commutated, linear motor. For each of the Yreaction movers 222, the first component 224 is secured to one of the Yreaction masses 200, 202 while the second component 226 is secured tothe stage base 12.

[0198] In FIGS. 8-10, the first component 224 of each Y reaction mover222 includes a pair of spaced apart magnet arrays (not shown) while thesecond component of each Y reaction mover includes a conductor array(not shown). With this design, the Y reaction movers 222 can make minorcorrections to the positions of the reaction masses 112, 114, 200, 202along the Y axis relative to the stage base 12. Alternately, forexample, the first component 224 of each Y reaction mover 222 couldinclude a conductor array while the second component 226 of each Yreaction mover 222 could include a pair of spaced apart magnet arrays.

[0199] Preferably, the Y reaction movers 222 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the Y reaction masses 200, 202 relative to thestage base 12 along the Y axis.

[0200] Alternately, in this embodiment, the second component 226 of eachreaction mover 220, 222 could be secured to the mounting base 24 withthe ground frame 164 (illustrated in FIG. 18) instead of to the stagebase 12.

[0201] FIGS. 11-13 illustrate a third embodiment having features of thepresent invention. In particular, FIG. 11 illustrates a perspective viewof the stage assembly 10, FIG. 12 illustrates a perspective view of thereaction mass assembly 18, and FIG. 13 illustrates an explodedperspective view of the reaction mass assembly 18. The stage assembly 10illustrated in FIG. 11 includes the stage base 12, a pair of stages 14,the stage mover assembly 16, the reaction mass assembly 18, and thecontrol system 22. The measurement system is not illustrated in FIG. 11.

[0202] In the embodiment illustrated in FIG. 11, each stage 14, thestage mover assembly 16, and the control system 22 are somewhat similarto the equivalent components described above. However, in the embodimentillustrated in FIGS. 11-13, the stage base 12 and the reaction massassembly 18 differ from the embodiment illustrated in FIGS. 1-3 and theembodiment illustrated in FIGS. 8-10.

[0203] In the embodiment illustrated in FIGS. 11-13, the X reactioncomponent 33A includes the X reaction masses 112, 114. However, in thisembodiment, instead of a reaction base, the Y reaction component 33Bincludes a reaction frame 300.

[0204] As can best be seen with reference to FIGS. 12 and 13, in thisembodiment, the stage base 12 is somewhat rectangular shaped andincludes a front lip 302, a rear lip 304, a raised central section 306,and a pair of spaced apart upper edge sections 307. The front lip 302cantilevers away from a front side of the stage base 12, and the rearlip 304 cantilevers away from a rear side of the stage base 12. Theraised central section 306 separates the upper edge sections 307. Theraised central section 306 includes a pair of spaced apart section sides309.

[0205] The reaction frame 300 is rectangular frame shaped and includes afirst frame side 308, a second frame side 310, a front frame side 312,and a rear frame side 314. Referring to FIG. 13, the first and secondframe sides 308, 310 are offset from and are positioned above the frontand rear frame sides 312, 314. This feature enhances the access to thestages 14.

[0206] The first frame side 308 and the second frame side 310 eachinclude an X mass guide 316 for guiding the X reaction masses 112, 114.Each X reaction mass 112, 114 includes an X follower 318. The X massguides 316 and the X followers 318 cooperate to form the mass guideassembly 131. In this embodiment, each X mass guide 316 cooperates withthe X follower 318 of one of the X reaction masses 112, 114, to guidethe movement of the X reaction masses 112, 114 along the X axis relativeto the reaction frame 300 and stage base 12. In the embodiments providedherein, the first and second frame sides 308, 310 are each somewhatrectangular beam shaped and each X follower 318 is a channel thatextends along the X axis in each of the X reaction masses 112, 114. Thefront and rear frame sides 312, 314 are also generally rectangularshaped.

[0207] Pressurized fluid is released and a vacuum is created between thefirst and second frame sides 308, 310 and the X reaction masses 112, 114to create a vacuum preload type fluid bearing (not shown). The vacuumpreload type fluid bearing maintains the X reaction masses 112, 114spaced apart from the reaction frame 300 and allows for independentrelative motion of the X reaction masses 112, 114 along the X axisrelative to the reaction frame 300 and stage base 12. Alternately, the Xreaction masses 112, 114 can be supported above the reaction frame 300by other ways such as a magnetic type bearing (not shown) or a ballbearing type assembly (not shown).

[0208] It should be noted in this embodiment, that the X reaction masses112, 114 and the reaction frame 300 move concurrently along the Y axis.

[0209] In the design provided in FIGS. 11-13, the first frame side 308and the second frame side 310 are positioned above the upper edgesections 307 and are separated by the raised central section 306.Further, the front frame side 312 is positioned below the front lip 302,and the rear frame side 314 is positioned below the rear lip 304. In theembodiment illustrated in FIGS. 11-13, the reaction frame 300 ismaintained above the stage base 12 with a reaction guide assembly 203.More specifically, in this embodiment, pressurized fluid (not shown) isreleased and a vacuum is pulled in fluid inlets (not shown) to create avacuum preload type fluid bearing between the stage base 12 and thereaction frame 300. The vacuum preload type, fluid bearing maintains thereaction frame 300 spaced apart from the stage base 12 along the X axisand along the Z axis. With this design, the vacuum preload type fluidbearing allows for motion of the reaction frame 300 along the Y axisrelative to the stage base 12. Further, the fluid bearing inhibitsmovement of the reaction frame 300 relative to the stage base 12 alongthe X axis, along the Z axis, and about the X, Y and Z axis.

[0210] Alternately, the reaction frame 300 can be supported spaced apartfrom the stage base 12 by other ways. For example, a magnetic typebearing (not shown) or a ball bearing type assembly (not shown) could beutilized that allows for motion of the reaction frame 300 relative tothe stage base 12.

[0211] Somewhat similar to the embodiment illustrated in FIGS. 1-3, inthis embodiment, the first component 108 of the first X stage mover 98is secured to and moves with the first X reaction mass 112; and, thefirst component 108 of the second X stage mover 100 is secured to andmoves with the second X reaction mass 114.

[0212] Further, the stage assembly 10 illustrated in FIG. 11 includes asingle, Y guide mover (not shown) that moves the guide assembly 50 alongthe Y axis relative to the stage base 12. In this embodiment, thereaction mover assembly 124 is used to make minor corrections along theY axis to the position of the reaction mass assembly 18 relative to thestage base 12. Further, the reaction mover assembly 124 is used toindependently make corrections to the position of the X reaction masses112, 114 along the X axis relative to the reaction frame 300.

[0213] In the embodiment illustrated in FIGS. 11-13, the reaction moverassembly 124 includes a first X reaction mover 320, a second X reactionmover 322, a first Y reaction mover 324, and a second Y reaction mover326, that cooperate to move the reaction mass assembly 18 relative tothe stage base 12.

[0214] Each of the reaction movers 320, 322, 324, 326 includes a firstcomponent 328 and an adjacent, second component 330. In the embodimentsprovided herein, one of the components 328, 330 of each reaction mover320, 322, 324, 326 includes one or more magnet arrays (not shown) andthe other component 328, 330 of each mover 320, 322, 324, 326 includesone or more conductor arrays (not shown). Electrical current (not shown)is individually supplied to each conductor array by the control system22. For each reaction mover 320, 322, the electrical current in eachconductor interacts with a magnetic field (not shown) generated by oneor more of the magnets in the magnet array. This causes a force (Lorentzforce) between the conductors and the magnets.

[0215] Specifically, in the embodiment illustrated in the FIGS. 11-13,each X reaction mover 320, 322 is a commutated, linear motor. For thefirst X reaction mover 320, the first component 328 is secured to thefirst X reaction mass 112 while the second component 330 is secured tothe first frame side 308 of the reaction frame 300. Similarly, for thesecond X reaction mover 322, the first component 328 is secured to thesecond X reaction mass 114 while the second component 330 is secured tothe second frame side 310 of the reaction frame 300.

[0216] It should be noted in this embodiment that each X reaction mass112, 114 includes a mass aperture 332, and that the second component 330of each X reaction mover 320, 322 extends through the mass aperture 332.

[0217] In this embodiment, the first component 328 of each X reactionmover 320, 322 includes a pair of spaced apart magnet arrays (not shown)while the second component 330 of each X reaction mover 320, 322includes a conductor array (not shown). With this design, the X reactionmovers 320, 322 can make minor corrections to the positions of the Xreaction masses 112, 114 along the X axis relative to the reaction frame300 and the stage base 12. Alternately, for example, the first componentof each X reaction mover could include a conductor array while thesecond component of each X reaction mover could include a pair of spacedapart magnet arrays.

[0218] Preferably, the X reaction movers 320, 322 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the X reaction masses 112, 114 relative to thereaction frame 300 and the stage base 12 along the X axis.

[0219] Somewhat similarly, in the embodiment illustrated in FIGS. 11-13,each Y reaction mover 324, 326 is a commutated, linear motor. For eachof the Y reaction movers 324, 326, the first component 328 is secured tothe reaction frame 300, while the second component 330 is secured to thestage base 12 or preferably to the mounting base 24. More specifically,for the first Y reaction mover 324, the first component 328 is securedto the front frame side 312, and the second component 330 is secured tothe front lip 302. Similarly, for the second Y reaction mover 326, thefirst component 328 is secured to the rear frame side 314, and thesecond component 330 is secured to the rear lip 304.

[0220] In this embodiment, the first component 328 of each Y reactionmover 324, 326 includes a pair of spaced apart magnet arrays (not shown)while the second component 330 of each Y reaction mover 324, 326includes a conductor array (not shown). With this design, the Y reactionmovers 324, 326 can make minor corrections to the position of thereaction frame 300 and the X reaction masses 112, 114 along the Y axisrelative to the stage base 12. Alternately, for example, the firstcomponent of each Y reaction mover could include a conductor array whilethe second component of each Y reaction mover could include a pair ofspaced apart magnet arrays.

[0221] Preferably, the Y reaction movers 324, 326 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the reaction frame 300 relative to the stagebase 12 along the Y axis.

[0222] FIGS. 14-16 illustrate a fourth embodiment having features of thepresent invention. In particular, FIG. 14 illustrates a perspective viewof the stage assembly 10, FIG. 15 illustrates a perspective view of thereaction mass assembly 18, and FIG. 16 illustrates an explodedperspective view of the reaction mass assembly 18. The stage assembly 10illustrated in FIG. 14 includes the stage base 12, a pair of stages 14,the stage mover assembly 16, the reaction mass assembly 18, and thecontrol system 22. The measurement system is not illustrated in FIG. 14.

[0223] In the embodiment illustrated in FIG. 14, each stage 14, thestage mover assembly 16, and the control system 22 are somewhat similarto the equivalent components described above. Further, the stage base 12and the reaction mass assembly 18 illustrated in FIGS. 14-16 are similarto the stage base 12 and reaction mass assembly 18 illustrated in FIGS.11-13 and described above. However, in the embodiment illustrated inFIGS. 14-16, the reaction frame 300 is free to move along the X axis,along the Y axis, and about the Z axis relative to the stage base 12.More specifically, in the embodiment, the fluid bearing between thereaction frame 300 and the stage base 12 only maintains the reactionframe 300 spaced apart along the Z axis relative to the stage base 12.Stated another way, the fluid bearing allows for motion of the reactionframe 300 along the X axis, along the Y axis, and about the Z axisrelative to the stage base 12.

[0224] Further, in the embodiment illustrated in FIGS. 14-16, thereaction mover assembly 124 differs from the reaction mover assembly 124illustrated in FIGS. 11-13 and described above. In particular, in theembodiment illustrated in FIGS. 14-16, the reaction mover assembly 124includes the X reaction movers 320, 322, a first Y reaction mover 350, asecond Y reaction mover 352, and a lower X reaction mover 354 thatcooperate to move the reaction mass assembly 18 relative to the stagebase 12.

[0225] In this embodiment, the reaction mover assembly 124 makes minorcorrections along the X axis, along the Y axis, and about the Z axis tothe position of the reaction frame 300 relative to the stage base 12.Further, the reaction mover assembly 124 makes independent correctionsto the position of the X reaction masses 112, 114 along the X axisrelative to the reaction frame 300.

[0226] The first and second X reaction movers 320, 322 are the same asillustrated in FIGS. 11-13 and described above. Each Y reaction mover350, 352, and the lower X reaction mover 354 includes a first component356 and an adjacent second component 358. One of the components of eachreaction mover 350, 352, 354 includes one or more magnet arrays (notshown) and the other component of each reaction mover 350, 352, 354includes one or more conductor arrays (not shown). Electrical current(not shown) is individually supplied to each conductor array by thecontrol system 22. For each reaction mover 350, 352, 354, the electricalcurrent in each conductor interacts with a magnetic field (not shown)generated by one or more of the magnets in the magnet array. This causesa force (Lorentz force) between the conductors and the magnets.

[0227] In the embodiment illustrated in the FIGS. 14-16, each Y reactionmover 350, 352 is a commutated linear motor. For the first Y reactionmover 350, the first component 356 is secured to the front frame side312 of the reaction frame 300, while the second component 358 is securedto the mounting base 24 (illustrated in FIG. 18) with a first reactionmover frame 360. Similarly, for the second Y reaction mover 352, thefirst component 356 is secured to the rear frame side 314 of thereaction frame 300, and the second component 358 is secured to themounting base 24 with a second reaction mover frame 362. Only a portionof each reaction mover frame 360, 362 is illustrated in FIGS. 14-16.

[0228] In this embodiment, the first component 356 of each Y reactionmover 350, 352, includes a pair of magnet arrays (not shown) while thesecond component 358 of each Y reaction mover 350, 352 includes aconductor array (not shown). With this design, the Y reaction movers350, 352 can make minor corrections to the positions of the X reactionmasses 112, 114 and the reaction frame 300 along the Y axis and aboutthe Z axis relative to the stage base 12. Alternately, for example, thefirst component of each Y reaction mover could include a conductor arraywhile the second component of each Y reaction mover could include a pairof spaced apart magnet arrays.

[0229] Preferably, the Y reaction movers 350, 352 include a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the X reaction frame 300 relative to the stagebase 12.

[0230] Somewhat similarly, the first component 356 and the secondcomponent 358 of the lower X reaction mover 354 interact to selectivelymove the reaction frame 300 along the X axis relative to the stage base12. In the embodiment illustrated in FIGS. 14-16, the lower X reactionmover 354 is a non-commutated voice coil motor. In this embodiment, forthe lower X reaction mover 354, the first component 356 is secured tothe front frame side 312 of the reaction frame 300, while the secondcomponent 358 is secured to the mounting base 24 with a third reactionmover frame 364.

[0231] In this embodiment, the first component 356 of the lower Xreaction mover 354 includes a pair of spaced apart magnet arrays (notshown) while the second component 358 includes a conductor array (notshown). With this design, the lower X reaction mover 354 can make minorcorrections to the position of the reaction frame 300 and the X reactionmasses 112, 114 along the X axis relative to the stage base 12.Alternately, for example, the first component of the lower X reactionmover could include a conductor array while the second component of eachY reaction mover could include a pair of spaced apart magnet arrays.

[0232] Preferably, the lower X reaction mover 354 includes a measurementdevice (not shown) such as an encoder that provides informationregarding the position of the reaction frame 300 relative to the stagebase 12 along the X axis.

[0233] Although it is not presently preferred, the second component 358of the first Y reaction mover 350, the second Y reaction mover 352 andlower X reaction mover 354 could be attached to the stage base 12.

[0234] As discussed above, the control system 22 directs and controlscurrent to the reaction mover assembly 124 to control the position ofthe reaction mass assembly 18 relative to the stage base 12. Preferably,the control system 22 controls current to the reaction mover assembly124 to prevent the X reaction masses 112, 114 from achieving a constantvelocity, and to keep the stroke of the reaction movers relativelyshort. Stated another way, the control system 22 controls current to thereaction mover assembly 124 to: (i) correct external disturbances thatcan influence the position of the reaction mass assembly 18, (ii) toprevent the X reaction masses 112, 114 from drifting off of the stagebase 12, (iii) to prevent unwanted motion of the assembly's center ofgravity 182, (iv) to prevent the exposure apparatus 30 from moving, and(v) to correct any torque that is transferred to the reaction massassembly 18.

[0235] Basically, the control system 22 controls current to the reactionmover assembly 124 to ensure that the X reaction masses 112, 114 and therest of the reaction mass assembly 18 are properly positioned and/orcentered relative to the stage base 12.

[0236] The control system 22 can control and direct current to thereaction mover assembly 124 at any time during the operation of thestage assembly 10 to correct the position of the X reaction masses 112,114 and the rest of the reaction mass assembly 18. As provided herein,the control system 22 and the reaction mover assembly 124 cancontinuously servo the reaction mass assembly 18 so that the reactionmass assembly 18 is centered on the stage base 12.

[0237] Preferably, the control system 22 controls and directs current tothe reaction mover assembly 124 in a way that minimizes the disturbancescreated by the reaction mover assembly 124 on the stage assembly 10 andthe exposure apparatus 30. More specifically, the timing and/or theamount of current from the control system 22 directed to the reactionmover assembly 124 can be varied to minimize the influence of thedisturbances created by the reaction mover assembly 124 on the stageassembly 10. Further, the timing and/or the amount of current can bevaried according to the use of the stage assembly.

[0238] In a first embodiment, for an exposure apparatus 30, the controlsystem 22 can control and direct current to the reaction mover assembly124 so that the reaction movers only move and correct the position ofthe reaction mass assembly 18 at selected times. For example, thereaction movers can be activated between exposures of the exposureapparatus 30 and deactivated during an exposure. Stated another way, forthe exposure apparatus 30, the control system 22 can be designed todirect current to the reaction mover assembly 124 only when anillumination system 504 (illustrated in FIG. 18) is not directing a beamof light energy at the reticle 32.

[0239] In this embodiment, the control system 22 can direct current tothe reaction mover assembly 124 between each chip (not shown) on thesemiconductor wafer 28, between each row of chips on the semiconductorwafer 28, between every scan of the semiconductor wafer 28, or betweeneach semiconductor wafer 28 processed by the exposure apparatus 30.Stated another way, the reaction mover assembly 124 can be activated tomove the reaction mass assembly 18 between each chip (not shown) on thesemiconductor wafer 28, between each row of chips on the semiconductorwafer 28, between every scan of the semiconductor wafer 28, or betweeneach semiconductor wafer 28 processed by the exposure apparatus 30.

[0240] Because the reaction mover assembly 124 is not activated duringan exposure, the disturbances created by the reaction mover assembly 124on the stage assembly 10 during exposure are minimized.

[0241] In another embodiment of the control system 22, the rate ofmovement of the reaction movers is varied according to the operation ofthe stage assembly 10. For example, for an exposure apparatus 30, thecontrol system 22 can control and direct current to the reaction moverassembly 124 at a different rate during an exposure than betweenexposures of the exposure apparatus 30. For example, during an exposure,the control system 22 can direct current to the reaction mover assembly124 so that the forces generated by the reaction mover assembly 124 arerelatively small and the gain is low. Alternately, between exposures,the control system 22 can direct current to the reaction mover assembly124 so that the forces generated by the reaction mover assembly 124 arerelatively large and the gain is high.

[0242] Stated another way, for the exposure apparatus 30, the controlsystem 22 can be designed to direct a relatively large current to thereaction mover assembly 124 only when an illumination system 504(illustrated in FIG. 18) is not directing a beam of light energy at thereticle 32.

[0243] As provided herein, the control system 22 can direct a relativelylarge current to the reaction mover assembly 124 between each chip (notshown) on the semiconductor wafer 28, between each row of chips on thesemiconductor wafer 28, between every scan of the wafer 28, or betweeneach semiconductor wafer 28 processed by the exposure apparatus 30. Withthis design, the control system 22 changes the closed loop bandwidthbetween exposures. Stated another way, the reaction mover assembly 124can make relatively large adjustments to the position of the reactionmass assembly 18 between each chip (not shown) on the wafer 28, betweeneach row of chips on the semiconductor wafer 28, between every scan ofthe semiconductor wafer 28, or between each semiconductor wafer 28processed by the exposure apparatus 30. Alternately, the reaction moverassembly 124 makes relatively small adjustments to the position on thereaction mass assembly 18 during an exposure.

[0244] Because the reaction mover assembly 124 makes relatively smalladjustments to the position on the reaction mass assembly 18 during anexposure, the disturbances created by the reaction mover assembly 124 onthe stage assembly 10 during exposure are minimized.

[0245]FIG. 17A illustrates a simplified schematic top view of a portionof a stage assembly 10 having a single stage 14 to facilitate adiscussion of the control system 22. In particular, FIG. 17A illustratesthe stage assembly 10 with one device table 48 positioned approximatelyhalf-way between the X reaction masses 112, 114 along the Y axis. InFIG. 17A, the device table 48 is positioned near the center of gravity400 of the stage assembly 10.

[0246] The following symbols are used in conjunction with FIG. 17A andthe discussion provided below to describe the movement of the reactionmass assembly 18:

[0247] L_(YM) represents the distance along the Y axis between thecenter of the first X stage mover 98 and the second X stage mover 100.

[0248] L_(CG) represents the distance along the Y axis between a stageassembly center of gravity 400 and a stage center of gravity 402.

[0249] P_(M1) represents the momentum of the first X reaction mass 112along the X axis.

[0250] P_(M2) represents the momentum of the second X reaction mass 114along the X axis.

[0251] F_(S1) represents the force generated by the first X stage mover98 (illustrated in phantom in FIG. 17A).

[0252] F_(S2) represents the force generated by the second X stage mover100.

[0253] F_(r1) represents the force generated by the first X reactionmover 404.

[0254] F_(r2) represents the force generated by the second X reactionmover 406.

[0255] The two equations that define the X stage mover 98, 100 forcebalance are

F _(S1) +F _(S2) =F _(X)  Force equation

F _(S1)(L _(YM)/2+L _(CG))−F _(S2)(L _(YM)/2−L _(CG))=0  Moment equation

[0256] Solving these two equations leads to

F _(S1) =F _(X)/2−[F _(X) L _(CG)]1/[L _(YM) ]F _(S2) =F _(X)/2+[F _(X)L _(CG) ]/[L _(YM)]

[0257] For each X reaction mass 112, 114, the total momentum (mxv) isequal to the time integral of the forces acting on it. Each X reactionmass 112, 114 has a reaction force generated by one of the X stagemovers 98, 100 and a corrective force generated by one of the X reactionmovers 404, 406.

P ₁ =m ₁ V ₁=∫(F _(S1) +F _(r1))dt

[0258] It is assumed that the first X reaction mover 404 and the secondX reaction mover 406 are driven in opposite directions with the sameamplitude.

F_(r1=F) _(r2)=F_(t)

[0259] A similar equation applies to the second X reaction mass 114.Substituting the previous result into these equations leads to:

P ₁=∫(F _(X)/2)dt−½L _(ym)(∫F _(X) L _(CG) dt)+∫F _(r1) dt

P ₂=∫(F _(X)/2)dt+½L _(ym)(∫F _(X) L _(CG) dt)+∫F _(r2) dt

[0260] These equations show that the momentum of each X reaction mass112, 114 is one-half the stage 14 momentum, plus a term that depends onthe time history of F_(X) and L_(CG), and the time integral of thereaction mover 404, 406 force. To ensure that the X reaction masses 112,114 are not left with a constant velocity when the stage 14 returns tozero velocity, the second and third terms must cancel. This leads to thefollowing equation:

∫F _(t) dt=1/(2Lym)∫F _(X) L _(CG) dt  (equation 1)

[0261] One easy solution to this integral equation is to let

F _(t) =F _(X) L _(CG)/(2Lym)

[0262] But this transmits the high frequency components of F_(X) throughthe reaction movers 404, 406. Ideally, the F_(t) would only have lowfrequency components.

[0263]FIG. 17B is a schematic that describes a method for reducing thefrequency content of F_(t). An input 408 is equal to F_(X)(L_(CG)/2Lym).The low frequency components of this input signal pass through low passfilter 412 to summing junction 416. The output of summing junction 416is the reaction force F_(t). The input signal 408 also goes tointegrator 410, which calculates the time integral∫F_(X)(L_(CG)/2Lym)dt.

[0264] A second integrator 418 integrates the output signal 420, andproduces the time integral ∫F_(t)dt. A differencing junction 414calculates an error signal which is the difference between the outputsof integrator 410 and second integrator 418. Compensator 415 performs acalculation (such as multiplying by a gain K) on the error signal toproduce a correction signal that is added to the output of low passfilter 412 in summing junction 416 to produce the output signal 420. Byadjusting the cutoff frequency of the low pass filter 412 and thecompensation calculation 415, the frequency content of output 420 can belimited to any desired value. The feedback loop through integrator 418and differencing junction 414 ensures that over time, the two integralsare equal and equation 1 is satisfied.

[0265]FIG. 18 is a schematic view illustrating an exposure apparatus 30useful with the present invention. The exposure apparatus 30 includesthe apparatus frame 46, the ground frame 164, an illumination system 504(irradiation apparatus), a reticle stage assembly 506, a lens assembly508, and a wafer stage assembly 510. The stage assemblies 10 providedherein can be used as the wafer stage assembly 510. Alternately, withthe disclosure provided herein, the stage assembly 10 provided hereincan be modified for use as the reticle stage assembly 506.

[0266] The exposure apparatus 30 is particularly useful as alithographic device that transfers a pattern (not shown) of anintegrated circuit from the reticle 32 onto the semiconductor wafer 28.The exposure apparatus 30 mounts to the mounting base 24, e.g., theground, a base, or floor or some other supporting structure.

[0267] The apparatus frame 46 is rigid and supports the components ofthe exposure apparatus 30. The design of the apparatus frame 46 can bevaried to suit the design requirements for the rest of the exposureapparatus 30. The apparatus frame 46 illustrated in FIG. 18 supports thelens assembly 508 and the illumination system 504 and the reticle stageassembly 506 above the mounting base 24.

[0268] The illumination system 504 includes an illumination source 512and an illumination optical assembly 514. The illumination source 512emits a beam (irradiation) of light energy. The illumination opticalassembly 514 guides the beam of light energy from the illuminationsource 512 to the lens assembly 508. The beam illuminates selectivelydifferent portions of the reticle 32 and exposes the semiconductor wafer28. In FIG. 18, the illumination source 512 is illustrated as beingsupported above the reticle stage assembly 506. Typically, however, theillumination source 512 is secured to one of the sides of the apparatusframe 46 and the energy beam from the illumination source 512 isdirected to above the reticle stage assembly 506 with the illuminationoptical assembly 514.

[0269] The lens assembly 508 projects and/or focuses the light passingthrough the reticle to the wafer. Depending upon the design of theexposure apparatus 30, the lens assembly 508 can magnify or reduce theimage illuminated on the reticle 32.

[0270] The reticle stage assembly 506 holds and positions the reticlerelative to the lens assembly 508 and the wafer. Similarly, the waferstage assembly 510 holds and positions the wafer with respect to theprojected image of the illuminated portions of the reticle 32. In FIG.18, the wafer stage assembly 510 utilizes a stage assembly 10 havingfeatures of the present invention. Depending upon the design, theexposure apparatus 30 can also include additional motors to move thestage assemblies 506, 510.

[0271] There are a number of different types of lithographic devices.For example, the exposure apparatus 30 can be used as scanning typephotolithography system that exposes the pattern from the reticle 32onto the wafer 28 with the reticle 32 and the wafer 28 movingsynchronously. In a scanning type lithographic device, the reticle 32 ismoved perpendicular to an optical axis of the lens assembly 508 by thereticle 32 stage assembly 506 and the wafer 28 is moved perpendicular toan optical axis of the lens assembly 508 by the wafer 28 stage assembly510. Scanning of the reticle 32 and the wafer 28 occurs while thereticle and the wafer 28 are moving synchronously.

[0272] Alternately, the exposure apparatus 30 can be a step-and-repeattype photolithography system that exposes the reticle 32 while thereticle 32 and the wafer 28 are stationary. In the step and repeatprocess, the wafer 28 is in a constant position relative to the reticle32 and the lens assembly 508 during the exposure of an individual field.Subsequently, between consecutive exposure steps, the wafer 28 isconsecutively moved by the wafer stage assembly 510 perpendicular to theoptical axis of the lens assembly 508 so that the next field of thewafer 28 is brought into position relative to the lens assembly 508 andthe reticle 32 for exposure. Following this process, the images on thereticle 32 are sequentially exposed onto the fields of the wafer 28 sothat the next field of the wafer 28 is brought into position relative tothe lens assembly 508 and the reticle 32.

[0273] However, the use of the exposure apparatus 30 provided herein isnot limited to a photolithography system for semiconductormanufacturing. The exposure apparatus 30, for example, can be used as anLCD photolithography system that exposes a liquid crystal display devicepattern onto a rectangular glass plate or a photolithography system formanufacturing a thin film magnetic head. Further, the present inventioncan also be applied to a proximity photolithography system that exposesa mask pattern by closely locating a mask and a substrate without theuse of a lens assembly. Additionally, the present invention providedherein can be used in other devices, including other semiconductorprocessing equipment, machine tools, metal cutting machines, andinspection machines.

[0274] The illumination source 512 can be g-line (436 nm), i-line (365nm), KrF excimer laser (248 nm), ArF excimer laser (193 nm) and F₂ laser(157 nm). Alternately, the illumination source 512 can also use chargedparticle beams such as an x-ray and electron beam. For instance, in thecase where an electron beam is used, thermionic emission type lanthanumhexaboride (LaB₆) or tantalum (Ta) can be used as an electron gun.Furthermore, in the case where an electron beam is used, the structurecould be such that either a mask is used or a pattern can be directlyformed on a substrate without the use of a mask.

[0275] In terms of the magnification of the lens assembly 508 includedin the photolithography system, the lens assembly 508 need not belimited to a reduction system. It could also be a 1× or magnificationsystem.

[0276] With respect to a lens assembly 508, when far ultra-violet rayssuch as the excimer laser is used, glass materials such as quartz andfluorite that transmit far ultra-violet rays is preferable to be used.When the F₂ type laser or x-ray is used, the lens assembly 508 shouldpreferably be either catadioptric or refractive (a reticle should alsopreferably be a reflective type), and when an electron beam is used,electron optics should preferably consist of electron lenses anddeflectors. The optical path for the electron beams should be in avacuum.

[0277] Also, with an exposure device that employs vacuum ultra-violetradiation (VUV) of wavelength 200 nm or lower, use of the catadioptrictype optical system can be considered. Examples of the catadioptric typeof optical system include the disclosure Japan Patent ApplicationDisclosure No.8-171054 published in the Official Gazette for Laid-OpenPatent Applications and its counterpart U.S. Pat. No. 5,668,672, as wellas Japan Patent Application Disclosure No.10-20195 and its counterpartU.S. Pat. No. 5,835,275. In these cases, the reflecting optical devicecan be a catadioptric optical system incorporating a beam splitter andconcave mirror. Japan Patent Application Disclosure No.8-334695published in the Official Gazette for Laid-Open Patent Applications andits counterpart U.S. Pat. No. 5,689,377 as well as Japan PatentApplication Disclosure No.10-3039 and its counterpart U.S. patentapplication Ser. No. 873,605 (Application Date: Jun. 12, 1997) also usea reflecting-refracting type of optical system incorporating a concavemirror, etc., but without a beam splitter, and can also be employed withthis invention. As far as is permitted, the disclosures in theabove-mentioned U.S. patents, as well as the Japan patent applicationspublished in the Official Gazette for Laid-Open Patent Applications areincorporated herein by reference.

[0278] Further, in photolithography systems, when linear motors (seeU.S. Pat. Nos. 5,623,853 or 5,528,118) are used in a wafer stage or amask stage, the linear motors can be either an air levitation typeemploying air bearings or a magnetic levitation type using Lorentz forceor reactance force. Additionally, the stage could move along a guide, orit could be a guideless type stage that uses no guide. As far as ispermitted, the disclosures in U.S. Pat. Nos. 5,623,853 and 5,528,118 areincorporated herein by reference.

[0279] Alternatively, one of the stages could be driven by a planarmotor, which drives the stage by an electromagnetic force generated by amagnet unit having two-dimensionally arranged magnets and an armaturecoil unit having two-dimensionally arranged coils in facing positions.With this type of driving system, either the magnet unit or the armaturecoil unit is connected to the stage and the other unit is mounted on themoving plane side of the stage.

[0280] Movement of the stages as described above generates reactionforces that can affect performance of the photolithography system.Reaction forces generated by the wafer (substrate) stage motion can bemechanically released to the floor (ground) by use of a frame member asdescribed in U.S. Pat. No. 5,528,118 and published Japanese PatentApplication Disclosure No. 8-166475. Additionally, reaction forcesgenerated by the reticle (mask) stage motion can be mechanicallyreleased to the floor (ground) by use of a frame member as described inU.S. Pat. No. 5,874,820 and published Japanese Patent ApplicationDisclosure No. 8-330224. As far as is permitted, the disclosures in U.S.Pat. No. Nos. 5,528,118 and 5,874,820 and Japanese Patent ApplicationDisclosure No. 8-330224 are incorporated herein by reference.

[0281] As described above, a photolithography system according to theabove described embodiments can be built by assembling varioussubsystems, including each element listed in the appended claims, insuch a manner that prescribed mechanical accuracy, electrical accuracy,and optical accuracy are maintained. In order to maintain the variousaccuracies, prior to and following assembly, every optical system isadjusted to achieve its optical accuracy. Similarly, every mechanicalsystem and every electrical system are adjusted to achieve theirrespective mechanical and electrical accuracies. The process ofassembling each subsystem into a photolithography system includesmechanical interfaces, electrical circuit wiring connections and airpressure plumbing connections between each subsystem. Needless to say,there is also a process where each subsystem is assembled prior toassembling a photolithography system from the various subsystems. Once aphotolithography system is assembled using the various subsystems, atotal adjustment is performed to make sure that accuracy is maintainedin the complete photolithography system. Additionally, it is desirableto manufacture an exposure system in a clean room where the temperatureand cleanliness are controlled.

[0282] Further, semiconductor devices can be fabricated using the abovedescribed systems, by the process shown generally in FIG. 19. In step601 the device's function and performance characteristics are designed.Next, in step 602, a mask (reticle) having a pattern is designedaccording to the previous designing step, and in a parallel step 603 awafer is made from a silicon material. The mask pattern designed in step602 is exposed onto the wafer from step 603 in step 604 by aphotolithography system described hereinabove in accordance with thepresent invention. In step 605 the semiconductor device is assembled(including the dicing process, bonding process and packaging process),finally, the device is then inspected in step 606.

[0283]FIG. 20 illustrates a detailed flowchart example of theabove-mentioned step 604 in the case of fabricating semiconductordevices. In FIG. 20, in step 611 (oxidation step), the wafer surface isoxidized. In step 612 (CVD step), an insulation film is formed on thewafer surface. In step 613 (electrode formation step), electrodes areformed on the wafer by vapor deposition. In step 614 (ion implantationstep), ions are implanted in the wafer. The above mentioned steps611-614 form the preprocessing steps for wafers during wafer processing,and selection is made at each step according to processing requirements.

[0284] At each stage of wafer processing, when the above-mentionedpreprocessing steps have been completed, the following post-processingsteps are implemented. During post-processing, first, in step 615(photoresist formation step), photoresist is applied to a wafer. Next,in step 616 (exposure step), the above-mentioned exposure device is usedto transfer the circuit pattern of a mask (reticle) to a wafer. Then instep 617 (developing step), the exposed wafer is developed, and in step618 (etching step), parts other than residual photoresist (exposedmaterial surface) are removed by etching. In step 619 (photoresistremoval step), unnecessary photoresist remaining after etching isremoved.

[0285] Multiple circuit patterns are formed by repetition of thesepreprocessing and post-processing steps.

[0286] A further embodiment of the invention will be described belowwith reference to FIGS. 21 to 28.

[0287]FIG. 21 shows the general configuration of an exposure apparatus700 according to an embodiment of the present invention. The exposureapparatus 700 is a scan-exposure apparatus of a step-and-scan type, thatis, a so-called scanning stepper. As will be described later, theexposure apparatus 700 of this embodiment includes a projection opticalsystem PL. In the following description: (a) the direction of theoptical axis AX of the projection optical system PL is designated aZ-axis direction; (b) the direction in which a reticle R serving as amask, and a wafer W serving as a substrate, are relatively scanned in aplane orthogonal to the Z-axis direction is designated a Y-axisdirection; and (c) the direction orthogonal to the Z-axis and Y-axisdirections is designated an X-axis direction. Additionally, the reticleand the wafer are generically referred to as “object”.

[0288] The exposure apparatus 700 includes an illumination system IOP, areticle stage RST serving as a mask stage for holding a reticle R, theprojection optical system PL, a wafer stage assembly 712 composed of awafer stage WST serving as a substrate stage for holding a wafer W and awafer driving unit 711 for two-dimensionally driving the wafer stage WSTin the X and Y directions, a control system for the devices, and thelike.

[0289] As disclosed in, for example, Japanese Laid-Open PatentApplication Publication Nos. 9-320956 and 4-196513 and U.S. Pat. No.5,473,410 corresponding thereto, the illumination system IOP includes alight-source unit, a shutter, a secondary light-source forming opticalsystem (optical integrator), a beam splitter, a light-collecting lenssystem, a reticle blind, an imaging lens system, and the like (all notshown). The IOP emits illumination light EL for exposure (hereinaftersimply referred to “exposure light”) serving as an exposure beam havinga substantially uniform illumination distribution. The exposure light ELilluminates a rectangular (or arcuate) illumination area IAR on areticle R at uniform illuminance. Used as the exposure light EL is, forexample, ultraviolet bright lines (g-rays and i-rays) from an extra-highpressure mercury lamp, or far-ultraviolet or vacuum ultraviolet lightsuch as KrF excimer laser light (with a wavelength of 248 nm), ArFexcimer laser light (with a wavelength of 193 nm), and F₂ laser light(with a wavelength of 157 nm).

[0290] The reticle stage RST is placed on a top plate 713 of a secondcolumn 729B constituting a main column 710, which will be describedlater. The top plate 713 also functions as a reticle base. Hereinafter,the top plate 713 will also be referred to as a “reticle base 713”.

[0291] A reticle R is fixed on the reticle stage RST by, for example,vacuum suction. In order to position the reticle R, the reticle stageRST is capable of two-dimensional micromotion (in the X-axis direction,the Y-axis direction orthogonal thereto, and the direction of rotationabout the Z-axis direction orthogonal to the XY plane) in a planeperpendicular to the Z-axis.

[0292] The reticle stage RST can also be moved on the reticle base 713at a designated scanning speed in a predetermined scanning direction (inthe Y-axis direction in this embodiment) by a reticle driving section(not shown) serving as a driving device having a linear motor and thelike. The stroke of the reticle stage RST is set so that the entiresurface of the reticle R can cross at least the optical axis of theillumination system IOP.

[0293] A movable mirror 17 is fixed on the reticle stage RST so as toreflect a laser beam from a reticle laser interferometer (hereinafterreferred to as a “reticle interferometer”) 715. The position of thereticle stage RST in a stage moving plane is constantly detected by thereticle interferometer 715 with a resolution of, for example,approximately 0.5 nm to 1 nm. In reality, and as is known in the art, amovable mirror having a reflecting surface orthogonal to the scanningdirection (Y-axis direction) and a movable mirror having a reflectingsurface orthogonal to the non-scanning direction (X-axis direction) aredisposed on the reticle stage RST, and one reticle interferometer isdisposed in the scanning direction and two reticle interferometers aredisposed in the non-scanning direction. In FIG. 21, the mirrors arerepresented by the movable mirror 717 and the interferometers arerepresented by the reticle interferometer 715.

[0294] Positional information (or speed information) about the reticlestage RST from the reticle interferometer 15 is sent to a main controlsystem 721 via a stage control system 719. The stage control system 719drives the reticle stage RST via the reticle driving section (not shown)based on the positional information about the reticle stage RSTaccording to directions from the main control system 21.

[0295] A pair of reticle alignment systems (not shown) is placed abovethe reticle R. The reticle alignment systems each include anepi-illumination system for illuminating a mark to be detected withillumination light having the same wavelength as that of the exposurelight EL, and a reticle alignment microscope for picking up an image ofthe mark to be detected. The reticle alignment microscope includes animaging optical system and an image pickup device. The result of imagepickup by the reticle alignment microscope is supplied to the maincontrol system 721.

[0296] The above-described main column 710 includes a first column 729Aplaced on a floor F of a clean room via a plurality ofvibration-isolating units 775, and the second column 729B placed on thefirst column 729A.

[0297] The first column 729A is composed of a plurality of columnsupports 723 placed in line at the tops of the respectivevibration-isolating units 775, and a barrel surface plate 725horizontally supported by the column supports 723. In this case,microvibrations to be transmitted from the floor F to the main column710 including the barrel surface plate 725 are isolated by thevibration-isolating units 775 on the microgravity level.

[0298] The second column 729B is composed of a plurality of leg portions727 embedded in the upper surface of the first column 729A, and theabove-described top plate (reticle base) 713 horizontally supported bythe leg portions 727.

[0299] The projection optical system PL is inserted from above throughan opening (not shown) formed in the center of the barrel surface plate725, and is supported by the barrel surface plate 725 via a flange (notshown) formed at about the center of a barrel thereof in the heightdirection. In this embodiment, the projection optical system PL is arefracting optical system that is formed of a double-sided telecentricreduction system composed of a plurality of lens elements arranged atpredetermined intervals along the optical-axis direction AX (the Z-axisdirection). The projection optical system PL may be a reduction systemthat is one-sided telecentric (for example, telecentric only on the sideof the wafer stage WST). The projection magnification of the projectionoptical system PL is set at, for example, ¼, ⅕, or ⅙. For this reason,when the illumination area IAR on the reticle R is illuminated withillumination light from the illumination optical system IOP, a reducedimage (partial inverted image) of a circuit pattern in the illuminationarea IAR of the reticle R is formed on an exposure area IA of a wafer Whaving a photoresist applied on its surface, which is conjugate with theillumination area IAR, via the projection optical system PL by theillumination light passed through the reticle R.

[0300] Adjacent to the projection optical system PL, an off-axisalignment microscope ALG is placed. The alignment microscope ALGincludes three types of alignment sensors, an LSA (Laser Step Alignment)type, an FIA (Field Image Alignment) type, and an LIA (LaserInterferometric Alignment) type, and can measure the positions in the Xand Y two-dimensional directions of a fiducial mark on a fiducial markplate and an alignment mark on the wafer.

[0301] In this embodiment, the three types of alignment sensors are useddepending on the operation, such as so-called search alignment fordetecting the positions of a predetermined number of search alignmentmarks on the wafer W so as to measure the general position of the waferW, and fine alignment for detecting the positions of a predeterminednumber of fine alignment marks on the wafer W so as to exactly measurethe positions of shot areas.

[0302] Digitized wave signals, which are obtained by convertinginformation from the alignment sensors constituting the alignmentmicroscope ALG from analog to digital by an alignment control device(not shown), are subjected to computation, and the mark positions arethereby detected. The detection result is transmitted to the maincontrol system 721.

[0303] The exposure apparatus 700 of this embodiment further includes amultipoint focal position detecting system serving as one ofoblique-incidence type focus detecting systems for detecting thepositions of the exposure area IA and the adjacent area in the Z-axisdirection (the optical axis direction AX) on the wafer W. The multipointfocal position detecting system is composed of a light-emitting opticalsystem and a light-receiving optical system that are not shown, and hasa structure similar to that disclosed in, for example, JapaneseLaid-Open Patent Application Publication No. 6-283403 and U.S. Pat. No.5,448,332 corresponding thereto.

[0304] The above-described wafer stage assembly 712 is placed below theprojection optical system PL. The wafer stage assembly 712 is composedof the wafer stage WST for holding a wafer W and the wafer driving unit711 serving as a driving device.

[0305] A wafer W is fixed on the upper surface of the wafer stage WSTvia a wafer holder (not shown) by electrostatic suction or vacuumsuction. A fiducial mark plate FM is also fixed on the wafer stage WST.The fiducial mark plate FM has various fiducial marks for base linemeasurement for measuring the distance from the center of detection ofthe alignment microscope ALG to the optical axis of the projectionoptical system PL.

[0306] On the upper surface of the wafer stage WST, as shown in FIG. 22,an X movable mirror 802X is disposed at one end in the X-axis direction(a +X-side end), and extends in the Y-axis direction, and a Y movablemirror 802Y is disposed at one end in the Y-axis direction (a −Y-sideend), and extends in the X-axis direction. The outer surfaces of themovable mirrors 802X and 802Y are mirror-finished reflecting surfaces.In FIG. 21, the movable mirrors 802X and 802Y are represented by amovable mirror 802.

[0307] An X-axis interferometer and a Y-axis interferometer (not shown)are placed opposed to the reflecting surfaces of the movable mirrors802X and 802Y. Interferometric beams from the X-axis and Y-axisinterferometers are projected onto the reflecting surfaces of themovable mirrors 802X and 802Y, and the reflected beams from thereflecting surfaces are received by the respective interferometers. Theamounts of displacement of the reflecting surfaces of the movablemirrors from the reference positions are thereby measured, so that thetwo-dimensional position of the wafer stage WST is detected. In FIG. 21,the X-axis interferometer and the Y-axis interferometer are representedby a wafer interferometer 33.

[0308] The wafer driving unit 711 will now be described in detail withreference to FIGS. 22 to 27.

[0309] Referring to FIG. 22, the wafer driving unit 711 includes: (a) aY-axis linear motor device (hereinafter referred to as a “Y-axis motordevice”) YM serving as a first driving device (or as a second drivingdevice) for driving the wafer stage WST on a wafer surface plate 714 inthe Y-axis direction, and (b) a first X-axis linear motor device(hereinafter referred to as a “first X-axis motor device”) XMA and asecond X-axis linear motor device (hereinafter referred to as a “secondX-axis motor device”) XMB serving as a second driving device (or as afirst driving device) for moving the wafer stage WST and the Y-axismotor device YM on the wafer surface plate 714 in the X-axis direction.

[0310] The first X-axis motor device XMA (more specifically, an X-axisstationary member 718A which will be described later) is supported in anon-contact manner by frames 716A1 and 716A2 fixed on the upper surfacesof two corners of a wafer base BS on the +Y-direction side so that it isrestrained in the Y-axis direction and the Z-axis direction. The secondX-axis motor device XMB (more specifically, an X-axis stationary member718B which will be described later) is similarly supported in anon-contact manner by frames 716B1 and 716B2 fixed on the upper surfacesof two corners of the wafer base BS on the −Y-direction side so that itis restrained in the Y-axis direction and the Z-axis direction.

[0311] The first X-axis motor device XMA includes the X-axis stationarymember 718A and an X-axis moving member 720A that moves in the X-axisdirection along the X-axis stationary member 718A in engagementtherewith, as shown in FIG. 22 and in FIG. 23, which is a partiallybroken view of the wafer stage WST and a part of the wafer drivingdevice shown in FIG. 22.

[0312] The X-axis stationary member 18A includes: (i) a magnetic poleunit 726A1 of U-shaped YZ-plane cross section that extends in the X-axisdirection, (ii) a magnetic pole unit 726A2 disposed on the −Z side(lower side) of the magnetic pole unit 726A1 and having a structuresimilar to that of the magnetic pole unit 726A1, (iii) platelike X-axisguide members 728A1 and 728A2 respectively disposed on the −Y-sides ofthe magnetic pole units 726A1 and 726A2 so as to extend in the X-axisdirection, and (iv) holding members 730A1 and 730A2 for holding themagnetic pole units 726A1 and 726A2 and the X-axis guide members 728A1and 728A2 in a predetermined positional relationship.

[0313] As shown in FIG. 23, the magnetic pole unit 726A1 includes a yoke732 of U-shaped cross section, and a plurality of field magnets 734arranged on the upper and lower opposing surfaces of the yoke 732 atpredetermined intervals in the X-axis direction. Since the pole faces ofthe field magnets 734 opposing in the Z-axis direction are opposite inpolarity, Z-axis direction magnetic flux is mainly generated between theopposing field magnets 734. Since the pole faces of the field magnets734 that are adjacent to each other in the X-axis direction are oppositein polarity, an alternating magnetic field is formed in the X-axisdirection in a space inside the yoke 732.

[0314] The magnetic pole unit 726A2 has a structure similar to that ofthe above-described magnetic pole unit 726A1.

[0315] As shown in FIG. 23, the holding member 30A1 includes: (i) afixing member 736A1 for fixing the magnetic pole units 726A1 and 726A2and the X-axis guide members 728A1 and 728A2 in a predeterminedpositional relationship, and (ii) an upper face member 740A1 and a lowerface member 738A1 for clamping the fixing member 736A1 from both sidesin the Z-axis direction (from above and below). An armature unit 742A1composed of armature coils arranged at predetermined intervals in theX-axis direction is embedded in the upper surface of the upper facemember 740A1, as shown in FIG. 23 and FIG. 24A, which is across-sectional view, taken along line D-D in FIG. 22. An armature unit742A2 similar to the armature unit 742A1 is embedded in the lowersurface of the lower face member 738A1.

[0316] The other holding member 730A2 includes a fixing member 736A2,and an upper face member 740A2 and a lower face member 738A2 forclamping the fixing member 736A2 from above and below, as shown in FIG.23.

[0317] The X-axis stationary member 718A with the above-describedstructure is supported in a non-contact manner by vacuum preloadhydrostatic gas bearing devices (hereinafter simply referred to as“bearing devices” for convenience) 99 disposed on the inner sides (bothinner sides in the Y-axis direction and both inner sides in the Z-axisdirection) of the frames 716A1 and 716A2 shown in FIG. 22 (see FIG. 24A;the bearing devices disposed in the frame 716A2 are not shown). That is,while the X-axis stationary member 718A is restrained in the Y-axisdirection and the Z-axis direction, it is not restrained at all in theX-axis direction. Therefore, when force in the X-axis direction acts onthe X-axis stationary member 718A, the X-axis stationary member 718Amoves in the X-axis direction in response to this force.

[0318] The X-axis stationary member 718A is substantially symmetric inthe vertical direction with respect to its center in the Z-axisdirection, as shown in FIG. 27 as a YZ cross-sectional view of the waferstage assembly 712. For this reason, the center of gravity of the X-axisstationary member 718A in the Z-axis direction lies at a point A₁.

[0319] The X-axis moving member 20A includes, as generally shown inFIGS. 22 and 23: (a) a slide member 746A, (b) a frame member 748A, and(c) armature units 750A1 and 750A2. The slide member 746A is formed of aflat plate having a +Y-side face opposing the X-axis guide members 728A1and 728A2. The frame member 748A has a rectangular cross section that isdisposed at about the center of the +Y-side face of the slide member746A in a space between the magnetic pole units 726A1 and 726A2 so as toextend toward the +Y side. The armature units 750A1 and 750A2 aredisposed at a nearly equal distance from the frame member 748A in the±Z-axis direction (at the positions corresponding to the inner spaces ofthe magnetic pole units 726A1 and 726A2) and have therein a plurality ofarmature coils arranged at predetermined intervals in the X-axisdirection.

[0320] The −Y-side face of the slide member 746A is provided with abearing device 754A (see FIG. 27), similar to a bearing device 754B of aslide member 746B, constituting an X-axis moving member 720B of thesecond X-axis motor device XMB which will be described later withreference to FIG. 23. The X-axis moving member 720A is supported in nocontact with the X-axis stationary member 718A with a clearance ofapproximately several micrometers therebetween in the Y-axis directionby static pressure of compressed gas (for example, helium or gaseousnitrogen (or clean air)) jetted from the bearing device 754A onto theX-axis guide members 728A1 and 728A2 constituting the above-describedX-axis stationary member 718A.

[0321] Similar bearing devices 752A1 and 752A2 are also disposed on theupper and lower surfaces of the frame member 748A (the bearing device752A2 is not shown in FIG. 23, but is shown in FIG. 27). The X-axismoving member 720A is supported in no contact with the X-axis stationarymember 718A with a clearance of approximately several micrometerstherebetween in the Z-axis direction by static pressure of compressedgas jetted from the bearing devices 752A1 and 752A2 onto the lowersurface of the magnetic pole unit 726A1 and the upper surface of themagnetic pole unit 726A2 constituting the X-axis stationary member 718A.

[0322] At the center of the slide member 746A, an opening 756A (see FIG.27) is formed so as to be similar to an opening 756B formed in the slidemember 746B constituting the X-axis moving member 720B of the secondX-axis motor device XMB shown in FIG. 23, which will be described later.The opening 756A communicates with a cavity 780A of the frame member748A.

[0323] Since the X-axis moving member 720A is substantially symmetric inthe vertical direction with respect to its center in the Z-axisdirection, as shown in FIG. 27, the position in the Y-axis direction andthe Z-axis direction of a center of gravity A₂ thereof coincides withthat of the center of gravity A₁ of the X-axis stationary member 718A.

[0324] In the first X-axis motor device XMA with the above-describedstructure, the X-axis moving member 720A is moved along the X-axis guidemembers 728A1 and 728A2 in the X-axis direction by Lorentz forceproduced by an electromagnetic interaction between the current passingthrough the armature coils of the armature units 750A1 and 750A2 and amagnetic field generated by the field magnets of the magnetic pole units726A1 and 726A2 of the X-axis stationary member 718A. In this case, theposition of the driving force (point of action of the driving force)acting on the X-axis moving member 720A in the X-axis directioncoincides with the position of the center of gravity A₂ of the X-axismoving member 720A. The position in the Y-axis direction and the Z-axisdirection of the reaction force (point of action of the reaction force)acting on the X-axis stationary member 718A in the X-axis direction inconnection with the driving of the X-axis moving member 720A coincideswith the position in the Y-axis direction and the Z-axis direction ofthe center of gravity A₁ of the X-axis stationary member 718A.

[0325] The amount and direction of driving force in the X-axis directionacting on the X-axis moving member 720A are controlled by the waveform(amplitude and phase) of current supplied from the main control system721 to the armature coils of the armature units 750A1 and 750A2 via thestage control system 719.

[0326] Refrigerant (coolant) is supplied to the armature units 750A1 and750A2 so as to cool the armature coils. The flow rate of the refrigerantis also controlled by the main control system 721.

[0327] The second X-axis motor device XMB is placed in rotationalsymmetry to the above-described first X-axis motor device XMA, as shownin FIG. 22, and is similarly constructed. That is, the second X-axismotor device XMB includes an X-axis stationary member 718B having astructure similar to that of the X-axis stationary member 718A of thefirst X-axis motor device XMA, and an X-axis moving member 720B having astructure similar to that of the X-axis moving member 720A.

[0328] The X-axis stationary member 718B includes: (i) magnetic poleunits 726B1 and 726B2 similar to the above magnetic pole units 726A1 and726A2, (ii) X-axis guide members 728B1 and 728B2 similar to the aboveX-axis guide members 728A1 and 728A2, and (iii) holding members 730B1and 730B2 for holding the magnetic pole units 726B1 and 726B2 and theX-axis guide members 728B1 and 728B2 in a predetermined positionalrelationship.

[0329] The holding member 730B1 disposed at the +X-side end of theX-axis stationary member 718B includes: (i) a fixing member 736B1similar to the above fixing member 736A1, and (ii) an upper face member740B1 and a lower face member 738B1 for clamping the fixing member 736B1from both sides in the Z-axis direction (from above and below). Anarmature unit 742B1 similar to the above armature unit 742A1 is embeddedin the upper surface of the upper face member 740B1, and an armatureunit 742B2 similar to the above armature unit 742A2 (see FIG. 24) isembedded in the lower surface of the lower face member 738B1.

[0330] The holding member 730B2 opposing the holding member 730B1 in theX-axis direction has a structure similar to that of the above holdingmember 730A2. That is, the holding member 730B2 includes a fixing member736B2, and an upper face member 740B2 and a lower face member 738B2 forclamping the fixing member 736B2 from above and below.

[0331] Since the X-axis stationary member 718B has the above-describedstructure, the position in the Z-axis direction of its center of gravityB₁ coincides with the position in the Z-axis direction of the center ofgravity A₁ of the X-axis stationary member 718A.

[0332] The frames 716B1 and 716B2 are provided, on their inner sides,with bearing devices 799 in a manner similar to that of the frames 716A1and 716A2 (see FIG. 24B).

[0333] As shown in FIG. 23, the X-axis moving member 720B includes: (a)a slide member 746B having a structure similar to that of the slidemember 746A, (b) a frame member 748B disposed at about the center of the−Y-side face of the slide member 746B and having a structure similar tothat of the frame member 748A, and (c) armature units 750B1 and 750B2disposed at a nearly equal distance from the frame member 748B in the ±Zdirection and having a structure similar to that of the armature units750A1 and 750A2.

[0334] The +Y-side face of the slide member 746B is provided with abearing device 754B, and the upper and lower faces of the frame member748B are provided with bearing devices 752B1 and 752B2 (not shown inFIG. 23, but shown in FIG. 27) similar to the above bearing devices752A1 and 752A2.

[0335] An opening 756B is formed in the center of the slide member 746B,as shown in FIG. 23. The opening 756B communicates with a cavity 780B ofthe frame member 748B (see FIG. 27).

[0336] The position in the Y-axis direction and the Z-axis direction ofthe center of gravity B₂ of the X-axis moving member 720B with theabove-described structure coincides with the position in the Y-axisdirection and the Z-axis direction of the center of gravity B₁ of theX-axis stationary member 718B, as shown in FIG. 27.

[0337] In the second X-axis motor device XMB, in a manner similar tothat of the first X-axis motor device XMA, the X-axis moving member 720Bis moved along the X-axis guide members 728B1 and 728B2 in the X-axisdirection by Lorentz force produced by an electromagnetic interactionbetween current passing through the armature coils of the armature units750B1 and 750B2 and a magnetic field generated by the field magnets ofthe magnetic pole units 726B1 and 726B2 of the X-axis stationary member718B. In this case, the position of the driving force (point of actionof the driving force) acting on the X-axis moving member 720B in theX-axis direction coincides with the position of the center of gravity B₂of the X-axis moving member 720B. The position in the Y-axis directionand the Z-axis direction of the reaction force (point of action of thereaction force) acting on the X-axis stationary member 718B in theX-axis direction in connection with the driving of the X-axis movingmember 720B coincides with the position in the Y-axis direction and theZ-axis direction of the center of gravity B of the X-axis stationarymember 718B.

[0338] In a manner similar to that of the first X-axis motor device XMA,the amount and direction of driving force in the X-axis direction actingon the X-axis moving member 720B are controlled by the waveform(amplitude and phase) of current supplied from the main control system721 to the armature coils of the armature units 750B1 and 750B2 via thestage control system 719.

[0339] Refrigerant is supplied to the armature units 750B1 and 750B2constituting the second X-axis motor device XMB so as to cool thearmature coils, in a manner similar to that of the above armature units750A1 and 750A2. The flow rate of the refrigerant is also controlled bythe main control system 721.

[0340] In the frame 716A1 corresponding to the holding member 730A1, asshown in FIG. 24A, magnetic pole units 744A1 and 744A2, each composed ofa magnetic material and a plurality of field magnets arranged atpredetermined intervals in the X-axis direction, are disposed at thepositions corresponding to the armature units 742A1 and 742A2 of theupper face member 740A1 and the lower face member 738A1 (that is, in theupper and lower opposing faces of the frame 716A1). In the magnetic poleunits 744A1 and 744A2, pole faces of the field magnets adjacent to eachother in the X-axis direction are opposite in polarity.

[0341] In the frame 716B1 corresponding to the holding member 730B1, asshown in FIG. 24B, which is a view of the holding member 730B1 and theframe 716B1, as viewed from the +X-axis direction, magnetic pole units744B1 and 744B2, each composed of a magnetic material and a plurality offield magnets arranged at predetermined intervals in the X-axisdirection, are disposed at the positions corresponding to the armatureunits 742B1 and 742B2 of the upper face member 740B1 and the lower facemember 738B1 (that is, in the upper and lower opposing faces of theframe 716B1). In the magnetic pole units 744B1 and 744B2, pole faces ofthe field magnets adjacent to each other in the X-axis direction areopposite in polarity.

[0342] For this reason, an alternating magnetic field is formed in theX-axis direction in a space where the armature units 742A1 and 742A2 areplaced opposed to the magnetic pole units 744A1 and 744A2. A periodicmagnetic field also is formed in the X-axis direction in a space wherethe armature units 742B1 and 742B2 are placed opposed to the magneticpole units 744B1 and 744B2.

[0343] As a result, the armature unit 742A1 serving as a moving memberand the magnetic pole unit 744A1 serving as a stationary memberconstitute a linear motor 745A1, and the armature unit 742A2 serving asa moving member and the magnetic pole unit 744A2 serving as a stationarymember constitute a linear motor 745A2, as shown in FIG. 24A. Thearmature unit 742B1 serving as a moving member and the magnetic poleunit 744B1 serving as a stationary member constitute a linear motor745B1, and the armature unit 742B2 serving as a moving member and themagnetic pole unit 744B2 serving as a stationary member constitute alinear motor 745B2, as shown in FIG. 24B. The linear motors 745A1,745A2, 745B1, and 745B2 generate driving force by an electromagneticinteraction.

[0344] The linear motors 745A1 and 745A2 constitute a first X-positioncorrection device, which will be described later, and the linear motors745B1 and 745B2 constitute a second X-position correction device. Theposition in the Y-axis direction and the Z-axis direction of the drivingforce in the X-axis direction applied from the first X-positioncorrection device to the X-axis stationary member 718A coincides withthe position in the Y-axis direction and the Z-axis direction of thecenter of gravity A₁ of the X-axis stationary member 718A shown in FIG.27. The position in the Y-axis direction and the Z-axis direction of thedriving force in the X-axis direction applied from the second X-positioncorrection device to the X-axis stationary member 718B coincides withthe position in the Y-axis direction and the Z-axis direction of thecenter of gravity B₁ of the X-axis stationary member 718B.

[0345] The amount and direction of driving force in the X-axis directionapplied from the first and second X-position correction devices actingon the X-axis stationary members 718A and 718B are controlled bycontrolling the waveform (amplitude and phase) of current supplied fromthe main control system 721 to the armature coils of the armature units742A1, 742A2, 742B1, and 742B2 via the stage control system 719.

[0346] Referring again to FIG. 22, the Y-axis motor device YM includes aY-axis stationary member 722 and a Y-axis moving member 770.

[0347] The Y-axis stationary member 722 includes, as shown in FIG. 25:(a) an armature unit 758 having therein a plurality of armature coilsarranged at predetermined intervals in the Y-axis direction andextending in the Y-axis direction, (b) a housing member 759 forsupporting and housing the armature unit 758, and (c) a pair of Y-axisguide members 763 and 764 disposed on both sides in the X-axis directionof the housing member 759. On the +Y-direction side, the armature coilsare arranged adjacent to the +Y-side ends of the Y-axis guide members763 and 764. In contrast, on the −Y-direction side, the ends of theY-axis guide members 763 and 764 protrude in the −Y direction.

[0348] As shown in FIG. 25, the Y-axis guide member 763 has iron plateholding portions 762A1 and 762B1 on the −X-side faces at both ends inthe longitudinal direction, and the Y-axis guide member 764 has ironplate holding portions 762A2 and 762B2 on the +X-side faces at both endsin the longitudinal direction. Iron plates 760A1, 760B1, 760A2, and760B2 (the iron plate 760B2 in the iron plate holding portion 762B2 isnot shown in FIG. 25, but is shown in FIG. 26) are embedded in the ironplate holding portions 762A1, 762B1, 762A2, and 762B2.

[0349] Both ends in the longitudinal direction of the Y-axis stationarymember 722 are, as shown in FIG. 23, inserted in the frame members 748Aand 748B via the openings 756A and 756B formed in the slide members 746Aand 746B of the above-described X-axis moving members 720A and 720B.

[0350]FIG. 26 is a partly omitted cross-sectional view of the Y-axismotor device YM and the X-axis moving members 720A and 720B, taken alongan X-Y plane slightly above the center in the height direction. As shownin FIG. 26, electromagnets 790A1, 790A2, 790B1, and 790B2 are fixed onthe inner side walls of the frame members 748A and 748B in the X-axismoving members 720A and 720B. The electromagnets 790A1, 790A2, 790B1,and 790B2 are respectively opposed to the iron plates 760A1, 760A2,760B1, and 760B2 embedded in the Y-axis ends of the Y-axis stationarymember 722. The Y-axis stationary member 722 is restrained in the X-axisdirection in a non-contact manner by magnetic force produced between theiron plates 760A1, 760A2, 760B1, and 760B2 and the electromagnets 790A1,790A2, 790B1, and 790B2. On the other hand, since the Y-axis stationarymember 722 is not restrained at all in the Y-axis direction, it can bemoved in the Y-axis direction in response to force applied in the Y-axisdirection. The iron plates 760A1, 760A2, 760B1, and 760B2 and theelectromagnets 790A1, 790A2, 790B1, and 790B2 constitute an X-axisrestraint mechanism for the Y-axis stationary member 722.

[0351] In the X-axis restraint mechanism, magnetic force between each ofthe electromagnets 790A1, 790A2, 790B1, and 790B2 and a correspondingiron plate is controlled by controlling current supplied to theelectromagnet via the stage control system 719 by the main controlsystem 721.

[0352] Such control of magnetic force between the iron plates 760A1,760A2, 760B1, and 760B2 and the corresponding electromagnets 790A1,790A2, 790B1, and 790B2 in the X-axis restraint mechanism allows theY-axis stationary member 722 and the wafer W (the wafer stage WST) to beslightly driven in a direction θ_(Z).

[0353] As shown in FIG. 25, placed inside the frame member 748A are: (i)a magnet 792A1 composed of a plurality of field magnets arranged atpredetermined intervals in the Y-axis direction so as to be opposed tothe upper surface of the armature unit 758, and (ii) a magnet 792A2 (notshown in FIG. 25, but shown in FIG. 27) composed of a plurality of fieldmagnets arranged at predetermined intervals in the Y-axis direction soas to be opposed to the lower surface of the armature unit 758. The polefaces of the opposing field magnets in the magnets 792A1 and 792A2 areopposite in polarity. As a result, the armature unit 758 and a magneticpole unit composed of the magnets 792A1 and 792A2 constitute a linearmotor for driving the Y-axis stationary member 722 in the Y-axisdirection.

[0354] The linear motor constitutes a Y-axis position correction devicewhich will be described later. The position in the X-axis direction andthe Z-axis direction of the driving force in the Y-axis direction to begiven from the Y-axis position correction device to the Y-axisstationary member 722 coincides with the position in the X-axisdirection and the Z-axis direction of a center of gravity C₁ of theY-axis stationary member 722 shown in FIG. 27. The amount and directionof driving force in the Y-axis direction applied from the Y-axisposition correction device and acting on the Y-axis stationary member722 are controlled by controlling the waveform (amplitude and phase) ofcurrent supplied from the main control system 721 to the armature coils,which constitute a part of the armature unit 758 held between themagnets 792A1 and 792A2, via the stage control system 719.

[0355] Below and adjacent to both ends in the Y-axis direction of theY-axis guide members 763 and 764, as shown in FIG. 27, floating members782A and 782B are placed. The floating members 782A and 782B have, attheir bottoms, bearing devices 755A and 755B for maintaining a clearancefrom the wafer surface plate 714. The floating members 782A and 782B andthe Y-axis stationary member 722 are supportingly floated at a distanceof approximately several micrometers from the wafer surface plate 714 bystatic pressure of compressed gas jetted from the bearing devices 755Aand 755B onto the upper surface of the wafer surface plate 714.

[0356] In the Y-axis stationary member 722, the armature unit 758 isfixed to the portions of the Y-axis guide members 763 and 764 slightlyoffset downward from the center in the Z-axis direction, as is evidentfrom the positional relationship between the armature unit 758 and theY-axis guide member 764 which is representatively shown in FIG. 27. Theposition in the Z-axis direction of the center of gravity C₁ of theY-axis stationary member 722 coincides with the position in the Z-axisdirection of the center of gravity A₁ of the X-axis stationary member718A described above.

[0357] Referring again to FIG. 25, the Y-axis moving member 770includes: (a) a magnet holding member 778 having a rectangular XZ crosssection shape, (b) a magnetic pole unit 772A placed on the upper innersurface of the magnet holding member 778 and having field magnetsarranged at predetermined intervals in the Y-axis direction and amagnetic pole unit 772B (not shown in FIG. 25, but shown in FIG. 27)placed on the lower inner surface of the magnet holding member 778 andhaving field magnets arranged at predetermined intervals in the Y-axisdirection, (c) a top plate 784 placed on the magnet holding member 778so as to be nearly square in plan view, and (d) a center of gravityadjusting member 786 placed under the magnet holding member 778. Theabove-described Y-axis stationary member 722 is passed through the innerspace of the magnet holding member 778.

[0358] The magnetic pole unit 772A is, as shown in FIG. 27, composed of:(i) a magnetic member 781A fixed on the upper inner surface of themagnet holding member 778, and (ii) a plurality of field magnets 783Aarranged on the lower surface of the magnetic member 781A atpredetermined intervals in the Y-axis direction. In this case, polefaces of the field magnets 783A face the upper surface of the armatureunit 758. The pole faces of the field magnets 783A adjacent to eachother in the Y-axis direction are opposite in polarity.

[0359] The magnetic pole unit 772B is composed of: (i) a magnetic member781B fixed on the lower inner surface of the magnet holding member 778,and (ii) a plurality of field magnets 783B arranged on the upper surfaceof the magnetic member 781B at predetermined intervals in the Y-axisdirection. In this case, pole faces of the field magnets 783B face thelower surface of the armature unit 758. The pole faces of the fieldmagnets 783B adjacent to each other in the Y-axis direction are oppositein polarity.

[0360] The pole faces of the above-described field magnets 783A and 783Bopposing in the Z-axis direction are opposite in polarity. For thisreason, magnetic flux in the Z-axis direction is mainly produced betweenthe opposing field magnets 783A and 783B. Since the pole faces of thefield magnets 783A and 783B that are adjacent to each other in theY-axis direction are opposite in polarity, as described above, analternating magnetic field is formed in the Y-axis direction in a spacebetween the field magnets 783A and 783B.

[0361] A plurality of bearing devices 794 are arranged on the bottomsurface of the center of gravity position adjusting member 786. TheY-axis moving member 770 is supportingly floated at a distance ofapproximately several micrometers from the wafer surface plate 714 bystatic pressure of compressed gas jetted from the bearing devices 794onto the upper surface of the wafer surface plate 714. Similarly,bearing devices (not shown) are provided on the inner faces of themagnet holding member 778 opposing in the X-axis direction, and theY-axis moving member 770 is held in no contact with (i.e., spaced from)the outer surfaces of the Y-axis guide members 763 and 764 constitutingthe Y-axis stationary member 722 at a distance of approximately severalmicrometers therefrom. By keeping the distance fixed, the Y-axis movingmember 770 and the wafer stage WST, which will be described later, areprevented from rotating (yawing) in θ_(Z) when the Y-axis moving member770 is driven in the Y-axis direction by the Y-axis linear motor.

[0362] The pressure and flow rate of compressed gas to be jetted fromthe bearing devices 794 of the Y-axis moving member 770 are controlledby the stage control system 719 shown in FIG. 21 according toinstructions from the main control system 721. The other bearing devicesdescribed above are also controlled in a similar manner.

[0363] As shown in FIG. 27, a Z-tilt driving mechanism 776 is placed onthe upper surface of the Y-axis moving member 770 so as to control theZ-axis position and attitude (tilt) of the wafer stage WST.

[0364] The Z-tilt driving mechanism 776 is composed of three voice coilmotors (not shown) that are placed at the positions on the upper surfaceof the top plate 784 of the Y-axis moving member 770 corresponding tothe vertexes of a nearly equilateral triangle so as to support andindependently and slightly drive the wafer stage WST in the Z-axisdirection. Therefore, the wafer stage WST is slightly driven by theZ-tilt driving mechanism 776 in three degree-of-freedom directions, theZ-axis direction, the θ_(X) direction (direction of rotation about theX-axis), and the θ_(Y) direction (direction of rotation about theY-axis). Driving of the Z-tilt driving mechanism 776 is controlled bythe stage control system 719 according to instructions from the maincontrol system 721.

[0365] Since the Y-axis moving member 770 has the structure describedabove, the position in the X-axis direction and the Z-axis direction ofa center of gravity C₂ of a composite of the Y-axis moving member 770and the wafer stage WST coincides with the position in the X-axisdirection and the Z-axis direction of the center of gravity C₁ of theY-axis stationary member 722, as shown in FIG. 27.

[0366] In the Y-axis motor device YM with the above-described structure,the Y-axis moving member 770 is moved along the Y-axis guide members 763and 764 in the Y-axis direction by Lorentz force produced by anelectromagnetic interaction between current passing through the armaturecoils of the armature unit 758 and a magnetic field generated by thefield magnets 783A and 783B of the magnetic pole units 772A and 772B ofthe Y-axis stationary member 722. In this case, the position of thedriving force (point of action of the driving force) in the Y-axisdirection acting on the Y-axis moving member 770 coincides with theposition of the center of gravity C₂ of the Y-axis moving member 770.The position in the Y-axis direction and the Z-axis direction of thereaction force (point of action of the reaction force) in the Y-axisdirection acting on the Y-axis stationary member 722 in connection withdriving of the Y-axis moving member 770 coincides with the position inthe X-axis direction and the Z-axis direction of the center of gravityC₁ of the Y-axis stationary member 722.

[0367] The amount and direction of driving force in the Y-axis directionacting on the Y-axis moving member 770 are controlled by controlling thewaveform (amplitude and phase) of current supplied from the main controlsystem 721 to the armature coils of the armature unit 758 via the stagecontrol system 719.

[0368] Refrigerant for cooling the armature coils is supplied to thearmature unit 758. The flow rate of the refrigerant is also controlledby the main control system 721.

[0369] An exposure operation by the exposure apparatus 700 of thisembodiment with the above structure will now be described. Exposure forsecond and subsequent layers of a wafer W will be described as anexample.

[0370] First, a reticle R is loaded onto the reticle stage RST by areticle loader (not shown). Subsequently, reticle alignment and baseline measurement are performed. During the reticle alignment and thebase line measurement, the main control system 721 controls the waferdriving unit 711 via the stage control system 719 so as to move thewafer stage WST two-dimensionally. For the purpose of suchtwo-dimensional movement of the wafer stage WST, the main control system721 controls the waveform of current supplied to the armature units750A1, 750A2, 750B1, and 750B2 for X-axis driving in the first andsecond X-axis motor devices XMA and XMB of the wafer driving unit 711and the waveform of current supplied to the armature coils of thearmature unit 758 of the Y-axis motor device YM, based on positionalinformation (or speed information) about the wafer stage WST from thewafer interferometer 733. When driving the wafer stage WST in the X-axisdirection, current is controlled so that driving forces given from thefirst and second X-axis motor devices XMA and XMB to the X-axis movingmembers 720A and 720B are equal in amount and direction.

[0371] In this case, since the X-axis moving members 720A and 720B arerestrained in a non-contact manner in the Y-axis direction and theZ-axis direction, as described above, they are stably driven by thefirst and second X-axis motor devices XMA and XMB. Furthermore, sincethe centers of gravity A₂ and B₂ of the X-axis moving members 720A and720B coincide with the driving forces acting on the X-axis movingmembers 720A and 720B, no torque is produced in the X-axis movingmembers 720A and 720B, and all the driving forces are translational inthe X-axis direction. This allows the X-axis moving members 720A and720B to be driven in the X-axis direction with high efficiency.

[0372] Since the Y-axis moving member 770 is restrained in a non-contactmanner in the X-axis direction and the Z-axis direction, as describedabove, it is stably driven by the Y-axis motor device YM. Furthermore,since the center of gravity C₂ of the Y-axis moving member 770 and thedriving force acting thereon coincide with each other, no torque isproduced in the Y-axis moving member 770, and all the driving force istranslational in the Y-axis direction. This allows the Y-axis movingmember 770 to be driven in the Y-axis direction with high efficiency.

[0373] When the X-axis moving members 720A and 720B are driven by thefirst and second X-axis motor devices XMA and XMB, reaction force in adirection opposite from the driving direction of the X-axis movingmembers 720A and 720B is produced in the X-axis stationary members 718Aand 718B. In this case, since the X-axis stationary members 718A and718B are restrained in a non-contact manner in the Y-axis direction andthe Z-axis direction, they are moved in the X-axis direction oppositefrom the driving direction of the X-axis moving members 720A and 720B inresponse to the reaction force according to the law of conservation ofmomentum. As a result, most of the reaction force acting on the X-axisstationary members 718A and 718B is absorbed (by their movement), ratherthan being transmitted to wafer surface plate 714. Consequently, it ispossible to substantially completely prevent vibration from beinggenerated due to the reaction force produced when the X-axis movingmembers 720A and 720B are driven.

[0374] The main control system 721 controls the waveform of currentsupplied to the armature coils of the armature units 742A1, 742A2,742B1, and 742B2 for X-axis driving in the first and second X-axisposition correction devices via the stage control system 719. By suchcontrol, the first and second X-axis position correction devices drivethe X-axis stationary members 718A and 718B in the X-axis direction atan appropriate time so that the X-axis stationary members 718A and 718Bare maintained within their stroke ranges even after being subsequentlymoved in the X-axis direction due to the reaction force produced bydriving of the X-axis moving members 720A and 720B.

[0375] When the Y-axis moving member 770 is driven by the Y-axis motordevice YM, reaction force in a direction opposite from the drivingdirection of the Y-axis moving member 770 is produced in the Y-axisstationary member 722. In this case, since the Y-axis stationary member722 is restrained in a non-contact manner in the X-axis direction andthe Z-axis direction, it is moved in the Y-axis direction opposite fromthe driving direction of the Y-axis moving member 770 in response to thereaction force according to the law of conservation of momentum. As aresult, most of the reaction force acting on the Y-axis stationarymember 722 is absorbed. Consequently, it is possible to substantiallycompletely prevent vibration from being generated due to the reactionforce produced when the Y-axis moving member 770 is driven.

[0376] The main control system 721 controls the waveform of currentsupplied to the armature coils of the armature unit 758 for Y-axisdriving in the Y-axis position correction device via the stage controlsystem 719. By such control, the Y-axis position correction devicedrives the Y-axis stationary member 722 in the Y-axis direction at anappropriate time so that the Y-axis stationary member 722 is maintainedwithin its stroke range even after being subsequently moved in theY-axis direction due to the reaction force produced by driving of theY-axis moving member 770.

[0377] Under such control of the wafer driving unit 711 by the maincontrol system 721, reticle alignment and base line measurement areperformed while moving the wafer stage WST. When the reticle alignmentand base line measurement are completed, a wafer W is loaded onto thewafer stage WST by a wafer loader (not shown). The wafer stage WST ismoved to a loading position in order for the wafer W to be loadedthereon. The movement of the wafer stage WST is controlled in a mannersimilar to that of the above reticle alignment.

[0378] As shown in FIG. 28, a plurality of shot areas SA_(ij) serving asareas to be exposed are arranged in a matrix on the loaded wafer W. Eachof the shot areas SA_(ij) has a chip pattern formed by exposure anddevelopment processes performed for the preceding layer, and a finealignment mark for fine alignment.

[0379] Subsequently, fine alignment is performed by, e.g., EnhancedGlobal Alignment (EGA) in which the array coordinates of the shot areasSA_(ij) on the wafer W are found by statistical calculation such as aleast squares method. In the fine alignment process, the wafer stage WSTis moved so that a predetermined fine alignment mark is placed in anobservation area of an alignment microscope ALG when observing the finealignment mark. The movement of the wafer stage WST is controlled in amanner similar to that of the above-described reticle alignment. Finealignment by EGA is disclosed in, for example, Japanese Laid-Open PatentApplication No. 61-44429 and U.S. Pat. No. 4,780,617 correspondingthereto.

[0380] Subsequently, exposure is effected on each shot area on the waferW by a step-and-scan method. The shot areas SA_(ij) are exposed in theorder illustrated in FIG. 28, that is, sequentially from a shot areaSA_(1,1) in the row direction (+X direction). When exposure of the lastshot area SA_(1,7) of the first row is completed, exposure is theneffected from the first SA_(2,9) of the second row in a row direction(−X direction) opposite from the direction of the first row.Subsequently, exposure is sequentially effected to the last shot areawhile reversing the direction of exposure at every linefeed.

[0381] Solid arrows in FIG. 28 show the direction of scanning forexposure areas IA in the shot areas of the wafer W. That is, thisembodiment adopts a so-called alternate scanning method in which thescanning direction is sequentially reversed as exposure progresses. Asthe exposure of the shot areas progresses, in fact, the wafer W is movedin a direction opposite from the direction shown by the solid arrows(including dotted lines) in FIG. 28.

[0382] In such an exposure process, the main control system 721 firstcontrols the wafer driving unit 711 via the stage control system 719based on the result of the above fine alignment and positionalinformation (or speed information) from the wafer interferometer 733,thereby moving the wafer stage WST so as to place the wafer W into astart position of scan-exposure for the first shot area SA_(1,1) on thewafer W. While the movement of the wafer stage WST in this case is alsocontrolled in a manner substantially similar to that of the abovereticle alignment, there are three differences as follows:

[0383] (1) At the scanning start position for the first shot areaSA_(1,1), the wafer W has a velocity component only in the −Y direction,and the velocity component is set at a predetermined value V_(W).

[0384] (2) At the scanning start position for the first shot areaSA_(1,1), the X-axis stationary members 718A and 718B are placed inpredetermined X-axis positions by the first and second X-axis positioncorrection devices. The predetermined X-axis positions are set so as toensure that there is sufficient space for the stroke of (i.e., themovement of) the X-axis stationary member 718A when it is moved in the+X-axis direction by reaction force produced when the wafer stage WST ismoved in the −X-axis direction by a distance corresponding to one shotarea of the wafer W (a distance X₁ shown in FIG. 28).

[0385] (3) At the scanning start position for the first shot areaSA_(1,1), the Y-axis stationary member 722 is placed in a predeterminedY-axis position by the Y-axis position correction device. Thepredetermined Y-axis position is set so as to ensure that there issufficient space for the stroke (i.e., the movement) of the Y-axisstationary member 722 when it is moved in the +Y-axis direction byreaction force produced by the movement of the wafer stage WST duringscan-exposure of the first shot area SA_(1,1) (by a distance S shown inFIG. 28) and the stepping movement thereof in the −Y-axis direction fromthe first shot area SA_(1,1) to the second shot area SA_(1,2) (by adistance Y₁ shown in FIG. 28) and to ensure that there is sufficientspace for the stroke of the Y-axis stationary member 722 when it ismoved in the −Y-axis direction by reaction force produced by thestepping movement of the wafer stage WST in the +Y-axis direction fromthe second shot area SA_(1,2) to the third shot area SA_(1,3) (by adistance Y₂ shown in FIG. 28).

[0386] Subsequently, the stage control system 719 starts relativemovement in the Y-axis direction between the reticle R and the wafer W,that is, between the reticle stage RST and the wafer stage WST,according to directions from the main control system 721. When both thestages RST and WST reach their respective target scanning speeds and arebrought into a constant-speed synchronous state, a pattern area of thereticle R starts to be illuminated with illumination light from theillumination optical system IOP, and scan-exposure is started. Theabove-described relative scanning is performed by controlling thereticle driving unit (not shown) and the wafer driving unit 711 by thestage control system 719 while monitoring the values measured by thewafer interferometer 733 and the reticle interferometer 715 describedabove.

[0387] The stage control system 719 synchronously controls the reticlestage RST and the wafer stage WST via the reticle driving unit and thewafer driving unit 711. In this case, in particular, during theabove-described scan-exposure, synchronous control is executed so thatthe ratio of the moving velocity V_(R) of the reticle stage RST in theY-axis direction and the moving velocity V_(W) of the wafer stage WST inthe Y-axis direction is maintained in accordance with the projectionmagnification (¼× or ⅕×) of the projection optical system PL.

[0388] Different pattern areas on the reticle R are sequentiallyilluminated with light. When illumination of all the pattern areas iscompleted, scan-exposure of the first shot area SA_(1,1) on the wafer Wis terminated. The pattern areas (i.e., the pattern) on the reticle Rare thereby reduced and transferred onto the first shot area SA_(1,1)via the projection optical system PL. After the completion ofscan-exposure, illumination of the pattern areas of the reticle R withthe illumination light is terminated.

[0389] In the above-described synchronous movement for scan-exposure,the wafer stage WST (and the wafer W) is moved by driving the Y-axismoving member 770 by the Y-axis motor device YM in the wafer drivingunit 711. During the synchronous movement, the Y-axis position of theY-axis stationary member 722 is not corrected by the Y-axis positioncorrection device. For this reason, reaction force produced by thedriving of the Y-axis moving member 770 functions as a driving force forthe Y-axis stationary member 722, which is completely freely movableaccording to the law of conservation of momentum, and thereby thereaction force is absorbed. As a result, it is possible to substantiallycompletely prevent vibration due to driving of the Y-axis moving member770 by the Y-axis motor device YM.

[0390] During the synchronous movement, of course, the driving of thewafer stage WST in the θ_(Z) direction by the X-axis restraint device,and the driving of the wafer stage WST in the Z-axis direction, theθ_(X) direction, and the θ_(Y) direction by the Z-tilt driving mechanism776 are appropriately performed. Since the X-axis restraint device andthe Z-tilt driving mechanism 776 have the structures described above, nosignificant variation occurs due to the driving.

[0391] When the above-described scan-exposure of the first shot areaSA_(1,1) is completed, the stage control system 719 controls the waferdriving unit 711 so that the wafer stage WST is moved in a steppingmanner to place the wafer W into the scanning start position of the nextshot area (herein, the second shot area SA_(1,2)). Such steppingmovement of the wafer W is made so as to satisfy the initial conditionsof the position and speed at the completion of scan-exposure of thefirst shot area SA_(1,1) and the following two at-end conditions:

[0392] (1′) At the scan-exposure starting position of the second shotarea SA_(1,2), the wafer W has a velocity component only in the +Ydirection, and the velocity component is set at the predetermined valueV_(W).

[0393] (2′) At the scan-exposure starting position of the second shotarea SA_(1,2), the X-axis stationary members 718A and 718B are placedinto predetermined X-axis positions by the first and second X-axisposition correction devices. The predetermined X-axis positions are setso as to ensure that there is sufficient room for the stroke of theX-axis stationary members 718A and 718B when they move in the +X-axisdirection by reaction force produced when the wafer stage WST is movedin the −X-axis direction by a distance corresponding to one shot area ofthe wafer W (a distance X₁ shown in FIG. 28).

[0394] The Y-axis position of the Y-axis stationary member 722 is notcorrected by the Y-axis position correction device.

[0395] Scan-exposure is effected on the second shot area SA_(1,2) in amanner similar to that of the first shot area SA_(1,1) except that thewafer W is moved in the +Y-direction.

[0396] Subsequent shot areas of the first row are sequentiallyscan-exposed while repeating the stepping operation and thescan-exposure operation described above.

[0397] When scan-exposure of the last shot area SA_(1,7) of the firstrow is completed, the stage control system 719 controls the waferdriving unit 711, according to instructions from the main control system721, so that the wafer stage WST is moved across the rows to move thewafer W to the scan-exposure starting position for the first shot areaSA_(2,9) of the second row. Such stepping movement across the rows ismade so as to satisfy the initial conditions of the position and speedat the completion of scan-exposure of the shot area SA_(1,7) and thefollowing three at-end conditions:

[0398] (1″) At the scan-exposure starting position of the shot areaSA_(2,9), the wafer W has a velocity component only in the −Y direction,and the velocity component is set at the predetermined value V_(W).

[0399] (2″) At the scan-exposure starting position of the shot areaSA_(2,9), the X-axis stationary members 718A and 718B are placed intopredetermined X-axis positions by the first and second X-axis positioncorrection devices. The predetermined X-axis positions are set so as toensure that there is sufficient room for the stroke of the X-axisstationary members 718A and 718B when they are moved in the −X-axisdirection by reaction force produced when the wafer stage WST is movedin the +X-axis direction by a distance corresponding to one shot area ofthe wafer W (distance X₁).

[0400] (3″) At the scan-exposure starting position for the shot areaSA_(2,9), the Y-axis stationary member 722 is placed into apredetermined Y-axis position by the Y-axis position correction device.The predetermined Y-axis position is set so as to ensure that there issufficient room for the stroke of the Y-axis stationary member 722 whenit is moved in the +Y-axis direction by reaction force produced by themovement of the wafer stage WST during scan-exposure of the shot areaSA_(2,9) and the stepping movement in the −Y-axis direction from theshot area SA_(2,9) to the next shot area SA_(2,8) and to ensure thatthere is sufficient room for the stroke of the Y-axis stationary member722 when it is moved in the −Y-axis direction by reaction force producedby the stepping movement of the wafer stage WST in the +Y-axis directionfrom the shot area SA_(2,8) to the next shot area SA_(2,7).

[0401] Subsequent shot areas of the second row are subjected toscan-exposure in a manner similar to that of the first row, except thatscan-exposure progresses in the −X-axis direction. After that,scan-exposure is effected on the shot areas of the remaining rows (3-7)in a manner similar to that of the first and second rows.

[0402] When all the shot areas on the wafer W have been scan-exposed,the wafer W is unloaded from the wafer stage WST by an unloader (notshown). When unloading the wafer W, the wafer stage WST is moved to anunloading position. The movement of the wafer stage WST is controlled ina manner similar to that of the above-described reticle alignment. Theprocesses for the wafer W are thereby completed.

[0403] As described above, in the exposure apparatus of the presentinvention, while the illumination light is being applied to the reticleR, that is, during scan-exposure, when the wafer stage WST is movedalong the wafer surface plate 714, the Y-axis stationary member 722 orthe X-axis stationary members 718A and 718B serving as a counter stage(countermass) are moved in a direction opposite from the movingdirection of the wafer stage WST. Since most of the reaction force dueto the driving of the wafer stage WST is absorbed, vibration will not becaused and exact exposure is possible. That is, exposure accuracy is notaffected by vibration resulting from reaction force produced due to thedriving of the wafer stage WST.

[0404] While illumination light is not applied onto the reticle R, theY-axis position correction device and/or the first and second X-axisposition correction devices appropriately correct the positions of theY-axis stationary member 722 or the X-axis stationary members 718A and718B so as to ensure that there is sufficient room for the stroke of theY-axis stationary member 722 or the X-axis stationary members 718A and718B when they are moved in subsequent operations. This shortens thetotal space required for the stroke of the Y-axis stationary member 722or the X-axis stationary members 718A and 718B, and thereby prevents theexposure apparatus 100 from being of increased size.

[0405] In this embodiment, since the X-axis stationary members and theY-axis stationary member serve as counter stages (countermasses) forabsorbing the reaction force of the wafer stage, it is possible toabsorb vibration resulting from the reaction force produced due to thedriving of the wafer stage, without providing another counter stage(countermass) separate from the wafer stage. This allows a smallerfootprint of the entire exposure apparatus. Furthermore, since theX-axis stationary members and the Y-axis stationary member serve ascounter stages (countermasses), they are automatically moved in adirection opposite from the moving direction of the wafer stage byreaction force produced when the wafer stage is moved. Consequently,another driving device for the counter stages is unnecessary, and thereaction force can be easily absorbed.

[0406] The positions of the center of gravity in the Y-axis directionand the Z-axis direction of the X-axis stationary member 718A and of theX-axis moving member 720A in the first X-axis motor device coincide withpositions of the points of action of the forces in the X-axis directionacting on the X-axis stationary member 718A and moving member 720A.Furthermore, the positions of the center of gravity in the Y-axisdirection and the Z-axis direction of the X-axis stationary member 718Band of the X-axis moving member 720B in the second X-axis motor devicecoincide with positions of the points of action of the forces in theX-axis direction acting on the X-axis stationary member 718B and movingmember 720B. Furthermore, the positions of the center of gravity in theX-axis direction and the Z-axis direction of the Y-axis stationarymember 722 and of the Y-axis moving member 770 in the Y-axis motordevice coincide with positions of the points of action of the forces inthe Y-axis direction acting on the Y-axis stationary member 722 andmoving member 770.

[0407] Accordingly, since during scan-exposure the moving members andthe stationary members are moved only in the X-axis direction or theY-axis direction by a combination movement therebetween according to thelaw of conservation of momentum, the center of gravity of a dynamicsystem composed of the moving members (stages) and the stationarymembers in combination is not displaced. Therefore, unbalanced load isnot produced and high-precision position control is possible.

[0408] The shot areas are arranged in a matrix on the wafer W, and theY-axis position of the Y-axis stationary member 722 in the Y-axis motordevice is corrected by the Y-axis position correction device between thecompletion of exposure of a predetermined row and the start of exposureof a row next to the predetermined row. Since the position of the Y-axisstationary member 722 in the Y-axis motor device is corrected during alinefeed operation in which exposure is suspended for a relatively longperiod, it is possible to prevent vibration and unbalanced load frombeing produced due to the driving of the wafer stage WST as would occurduring scan-exposure. It is also possible to reduce driving force to beapplied to the Y-axis stationary member 722 at the time of correctionand to thereby decrease vibration due to the driving of the Y-axisstationary member 722 to be transmitted to other sections of theexposure apparatus.

[0409] While the exposure process of the second layer and subsequentlayers of the wafer has been described in this embodiment, advantagessimilar to those of the above embodiment can also be obtained inexposure of the first layer of the wafer that is effected in a mannersimilar to that of the second layer and subsequent layers, except thatwafer alignment (search alignment and fine alignment) is not performed.

[0410] While the stationary members of the motor devices for moving thewafer stage WST are used to absorb reaction force of the wafer stage WSTin the above embodiment, another countermass mechanism may be added.

[0411] While absorption of reaction force produced due to the driving ofthe wafer stage WST has been described in the above embodiment, thepresent invention is also applicable to the driving of the reticle stageRST for holding the reticle R. That is, the position of a counter stage(countermass), which moves in a direction opposite from the drivingdirection of the reticle stage RST, may be corrected to a predeterminedposition when exposure light is not applied. Additionally, the reticlestage may hold a plurality of reticles.

[0412] While the exposure apparatus 700 of the above embodiment has onlyone wafer stage WST, it may have two wafer stages. An exposure apparatus700′ according to a modification of the above embodiment has two waferstages WST1 and WST2, which can independently move in two dimensions, asshown in FIG. 29. In the following description of the exposure apparatus700′, components identical or equivalent to the components of theexposure apparatus 700 are denoted by like numerals, and theirrepetitive explanations will also be omitted.

[0413] Referring to FIG. 29, the exposure apparatus 700′ of thismodification is different from the exposure apparatus 700 shown in FIG.21 in that it includes: (a) alignment microscopes ALG1 and ALG2 placedat equal distances from a projection optical system PL, and (b) a waferdriving unit 811 for moving the wafer stages WST1 and WST2two-dimensionally. The wafer stages WST1 and WST2 and the wafer drivingunit 811 constitute a wafer stage assembly 812 of this modification.

[0414] In order to detect the XY positions and the rotations about theZ-axis of the wafer stages WST1 and WST2, the exposure apparatus 700′also includes: (c) X-axis interferometers 733A and 733B for applying aninterferometric beam to X movable mirrors of the wafer stages WST1 andWST 2, and (d) three Y-axis interferometers (not shown) for applyinginterferometric beams, passing through the center of projection of aprojection optical system PL and the centers of detection of thealignment microscopes ALG1 and ALG2, onto Y-axis movable mirrors of thewafer stages WST1 and WST2. As shown in FIG. 30, an X movable mirror802X and a Y movable mirror 802Y are placed on the upper surface of thewafer stage WST1, and an X movable mirror 803X and a Y movable mirror803Y are similarly placed on the upper surface of the wafer stage WST2.The movable mirrors are represented by a movable mirror 802 and amovable mirror 803 in FIG. 29.

[0415] Other sections are similar to those of the above-describedexposure apparatus 700.

[0416] In the wafer driving unit 811, as shown in FIG. 30, X-axis movingmembers 720A1 and 720A2 similar to the above-described X-axis movingmember 720A are provided for an X-axis stationary member 718A, andX-axis moving members 720B1 and 720B2 similar to the above-describedX-axis moving member 720B are provided for an X-axis stationary member718B. Furthermore, a Y-axis motor device YMA similar to theabove-described Y-axis motor device YM extends between the X-axis movingmembers 720A1 and 720B1, and a Y-axis motor device YMB similar to theabove-described Y-axis motor device YM extends between the X-axis movingmembers 720A2 and 720B2.

[0417] The wafer stage WST1 is placed on the upper surface of a movingmember 770A of the Y-axis motor device YMA, and the wafer stage WST2 isplaced on the upper surface of a moving member 770B of the Y-axis motordevice YMB.

[0418] Accordingly, the wafer stage WST1 is moved in the X-axisdirection by the X-axis motor device XMA1 composed of the X-axisstationary member 718A and the X-axis moving member 720A1 and the X-axismotor device XMB1 composed of the X-axis stationary member 718B and theX-axis moving member 720B1, and is moved in the Y-axis direction by theY-axis motor device YMA composed of the Y-axis stationary member 722Aand the Y-axis moving member 770A. In contrast, the wafer stage WST2 ismoved in the X-axis direction by the X-axis motor device XMA2 composedof the X-axis stationary member 718A and the X-axis moving member 720A2and the X-axis motor device XMB2 composed of the X-axis stationarymember 718B and the X-axis moving member 720B2, and is moved in theY-axis direction by the Y-axis motor device YMB composed of the Y-axisstationary member 722B and the Y-axis moving member 770B. That is, thewafer stages WST1 and WST2 are two-dimensionally moved in a mannersimilar to that of the above-described wafer stage WST.

[0419] In the exposure apparatus 700′ of this modification, a concurrentoperation is possible, that is, while shot areas on one of the wafers W1and W2 placed on the wafer stages WST1 and WST2, which can independentlymove in two dimensions, as described above, are sequentially subjectedto scan-exposure similar to that in the above embodiment, the otherwafer is subjected to alignment similar to that in the above embodiment.

[0420] During such a concurrent operation, for example, in a case inwhich the wafer stage WST2 is moved in the X-axis direction by theX-axis motor devices XMA2 and XMB2 while the wafer W1 is scan-exposed bymoving the wafer stage WST1 in the Y-axis direction by the Y-axis motordevice YMA, the X-axis stationary members 718A and 718B receive areaction force in a direction opposite from the driving direction of thewafer stage WST2. As a result, if the X-axis position correction deviceis not operated, the X-axis stationary members 718A and 718B will movein a direction opposite to the driving direction of the stage WST2,which will cause the wafer stage WST1 to move in the X-axis directionidentical to the moving direction of the X-axis stationary members 718Aand 718B. This would cause the exposure accuracy for the wafer W1 tosignificantly deteriorate. In contrast, if the X-axis stationary members718A and 718B are prevented from moving by operating the X-axis positioncorrection device, absorption of reaction force (caused by X-directionmovement of the stage WST2) based on the law of conservation of momentumis impossible. This causes vibration that affects the wafer stage WST1,and also deteriorates exposure accuracy for the wafer W1.

[0421] Since the Y-axis motor devices YMA and YMB have theabove-described structure (i.e., they are independent from each other),the Y-axis motor device for moving one of the wafers in the Y-axisdirection does not have any adverse effect, such as vibration orundesired displacement, on the other wafer. In other words, when onewafer stage (WST1 or WST2) is driven in the Y-direction, its stationarymember (722A or 722B) can be permitted to move in order to absorbreaction force, and such movement will not cause the Y-direction (orX-direction) position of the other stage (WST2 or WST1) to change.

[0422] Accordingly, in the exposure apparatus 700′ of this modification,wafer movement control is executed so that one of the wafers is notmoved in the X-axis direction while the other wafer is beingscan-exposed. Therefore, when exposure light EL is applied to the waferW1, vibration resulting from the driving of the motor for moving theother wafer is not transmitted to the wafer stage WST1. This allowshigh-precision exposure.

[0423] Since exposure and alignment are concurrently performed in theexposure apparatus 700′ of this modification, as described above,throughput can be improved.

[0424] In this modification, movement control may be executed so that,when one of the wafers moves in the X-axis direction, the other waferalso moves in the same direction by nearly the same distance. This makesit possible to reduce the distance between the center of projection ofthe projection optical system PL and the center of detection of thealignment microscope ALG1 or the alignment microscope ALG2 (so as to belonger than the diameter of the wafer) and to thereby reduce the size ofthe exposure apparatus. Since the size of the stage surface plate 714can also be reduced, production thereof is facilitated.

[0425] While the stage device according to the above embodiment of theinvention is applied to the scanning stepper, the invention also isapplicable to a stationary exposure apparatus, such as a stepper thateffects exposure while a mask and a substrate are stationary. In such acase, since reaction force produced when a substrate stage for holdingthe substrate is driven can be absorbed, high-precision exposure issimilarly possible without causing displacement of a transferred image.

[0426] The stage device of the invention is also applicable to aproximity exposure apparatus in which a pattern on a mask is transferredonto a substrate with the mask and the substrate placed in closeproximity without using a projection optical system therebetween.

[0427] The invention is, of course, also applicable not only to anexposure apparatus for use in fabrication of semiconductor devices, butalso to an exposure apparatus that transfers a device pattern onto aglass plate so as to produce displays, such as liquid crystal displayand plasma displays, an exposure apparatus that transfers a devicepattern onto a ceramic wafer so as to produce thin-film magnetic heads,and an exposure apparatus for use in producing image pickup devices,such as CCDs.

[0428] The invention is also applicable not only to microdevices such assemiconductor devices, but also to an exposure apparatus that transfersa circuit pattern onto a glass substrate, a silicon wafer, and the likein order to manufacture a reticle or a mask for use in an opticalexposure apparatus, an EUV (Extreme Ultraviolet) exposure apparatus, anX-ray exposure apparatus, an electron beam exposure apparatus, and thelike. In an exposure apparatus using DUV (Deep Ultraviolet) light, VUV(Vacuum Ultraviolet) light, and the like, a transmissive reticle isgenerally used, and a reticle substrate is made of quartz glass, quartzglass doped with fluorine, fluorite, magnesium fluoride, or quartzcrystal. In the proximity exposure apparatus or the electron beamexposure apparatus, a transmissive mask (a stencil mask or a membranemask) is used. In the EUV exposure apparatus, a reflective mask is used,and a silicon wafer or the like is used as a mask substrate.

[0429] The stage device used in the exposure apparatus of the inventionis also widely applicable to other substrate processing apparatus (forexample, a laser apparatus or a substrate inspection apparatus), asample positioning device in other precision machines, and a wirebonding device.

[0430] The exposure apparatus of the invention may employ not only theprojection optical system, but also a charged particle beam opticalsystem, such as an X-ray optical system or an electron optical system.For example, the electron optical system includes an electron lens and apolarizer, and thermoelectron-emitting lanthanum hexaborite (LaB₆) ortantalum (Ta) is used as an electron gun. Of course, the optical paththrough which an electron beam passes is placed in a vacuum. Theexposure apparatus of the invention may use, as exposure light, not onlythe above-described far ultraviolet light or vacuum ultraviolet light,but also soft X-ray EUV light with a wavelength of 5 nm to 30 nm.

[0431] For example, the vacuum ultraviolet light includes ArF excimerlaser light and F₂ laser light. Alternatively, a harmonic wave may beused which is obtained by amplifying single-waveform laser light in aninfrared region or a visible region emitted from a DFB semiconductorlaser or a fiber laser by, for example, a fiber amplifier doped witherbium (or both erbium and ytterbium) and wavelength-converting thelaser light into ultraviolet light by using nonlinear optical crystal.

[0432] While the projection optical system is of a reduction type in theabove embodiments, it may be of a 1× (unity) magnification type or of amagnification type.

[0433] An illumination unit, a projection optical system, and the likecomposed of a plurality of lenses is incorporated in the main body ofthe exposure apparatus so as to provide for optical adjustment. Variouscomponents, such as the X-axis stationary member, the X-axis movingmember, the Y-axis stationary member, the wafer stage, and the reticlestage described above, and other components, are mechanically andelectrically combined and adjusted, and are subjected to totaladjustment (e.g., electric adjustment and operation check), therebyproducing an exposure apparatus of the invention such as the exposureapparatus 100 in the above embodiment. Preferably, the exposureapparatus is produced in a clean room in which the temperature, thelevel of air cleanliness, and the like are controlled.

[0434] While the invention has been described with reference topreferred embodiments thereof, it is to be understood that the inventionis not limited to the preferred embodiments or constructions. To thecontrary, the invention is intended to cover various modifications andequivalent arrangements. In addition, while the various elements of thepreferred embodiments are shown in various combinations andconfigurations, which are exemplary, other combinations andconfigurations, including more, less or only a single element, are alsowithin the spirit and scope of the invention.

What is claimed is:
 1. A stage assembly for use with an apparatus, thestage assembly moving a device relative to a stage base so that thedevice is properly positioned for one or more operations performed bythe apparatus, the stage assembly comprising: a stage that retains thedevice; a stage mover assembly that moves the stage relative to thestage base, the stage mover assembly generating reaction forces; areaction mass assembly coupled to the stage mover assembly, the reactionmass assembly reducing the reaction forces that are transferred to thestage base; a reaction mover assembly that moves the reaction massassembly relative to the stage base; and a control system connected tothe reaction mover assembly, the control system controlling excitationof the reaction mover assembly based upon the status of the one or moreoperations.
 2. The stage assembly of claim 1 wherein the control systemdoes not direct current to the reaction mover assembly during at leastone of the operations.
 3. The stage assembly of claim 2 wherein thecontrol system directs current to the reaction mover assembly betweenthe operations.
 4. The stage assembly of claim 1 wherein the controlsystem directs more current to the reaction mover assembly betweenoperations than during the operations.
 5. The stage assembly of claim 1wherein the stage mover assembly moves the stage with two degrees offreedom and the reaction mass assembly is adapted to reduce the reactionforces in the two degrees of freedom that are transferred to the stagebase.
 6. The stage assembly of claim 1 wherein the stage mover assemblymoves the stage with three degrees of freedom and the reaction massassembly is adapted to reduce the reaction forces in the three degreesof freedom that are transferred to the stage base.
 7. The stage assemblyof claim 1 wherein the reaction mover assembly adjusts the position ofthe reaction mass assembly relative to the stage base with one degree offreedom.
 8. The stage assembly of claim 1 wherein the reaction moverassembly adjusts the position of the reaction mass assembly relative tothe stage base with two degrees of freedom.
 9. The stage assembly ofclaim 1 wherein the reaction mover assembly adjusts the position of thereaction mass assembly relative to the stage base with three degrees offreedom.
 10. The stage assembly of claim 1 wherein the reaction massassembly includes an X reaction component and a Y reaction componentthat are coupled to the stage mover assembly, the X reaction componentmoves relative to the Y reaction component along an X axis and the Xreaction component and the Y reaction component move concurrently alonga Y axis relative to the stage base.
 11. The stage assembly of claim 10wherein the reaction mover assembly adjusts the position of the Xreaction component relative to the Y reaction component along the Xaxis.
 12. The stage assembly of claim 11 wherein the reaction moverassembly adjusts the position of the Y reaction component and the Xreaction component relative to the stage base along the Y axis.
 13. Thestage assembly of claim 12 wherein the reaction mover assembly adjuststhe position of the Y reaction component and the X reaction componentrelative to the stage base about a Z axis.
 14. The stage assembly ofclaim 10 wherein the X reaction component includes a first X reactionmass and a second X reaction mass that move independently along the Xaxis relative to the Y reaction component and the reaction moverassembly adjusts the position of the X reaction masses relative to the Yreaction component.
 15. An exposure apparatus comprising the stageassembly of claim 1 and an illumination source having an on position andan off position, in the on position, the illumination source directs abeam of light energy towards the stage assembly, in the off position,the illumination source does not direct a beam of light energy towardsthe stage assembly.
 16. The exposure apparatus of claim 15 wherein thecontrol system controls current to the reaction mover assembly basedupon the position of the illumination source.
 17. The exposure apparatusof claim 15 wherein the control system does not direct current to thereaction mover assembly when the illumination source is in the onposition.
 18. The exposure apparatus of claim 17 wherein the controlsystem directs current to the reaction mover assembly when theillumination source is in the off position.
 19. The exposure apparatusof claim 15 wherein the control system directs more current to thereaction mover assembly when the illumination source is in off positionthan when the illumination source is in the on position.
 20. A devicemanufactured by the exposure apparatus of claim
 15. 21. A wafer on whichan image has been formed by the exposure apparatus of claim
 15. 22. Anexposure apparatus comprising the stage assembly of claim 1, theexposure apparatus being adapted to form images on the device.
 23. Theexposure apparatus of claim 22 wherein the control system directscurrent to the reaction mover assembly between the forming of each imageon the device and does not direct current to the reaction mover assemblyduring the forming of each image on the device.
 24. The exposureapparatus of claim 22 wherein the control system directs current to thereaction mover assembly between the forming of each row of images on thedevice and does not direct current to the reaction mover assembly duringthe forming of each row of images on the device.
 25. The exposureapparatus of claim 22 wherein the control system directs current to thereaction mover assembly between each scan of the device and does notdirect current to the reaction mover assembly during each scan of thedevice.
 26. The exposure apparatus of claim 22 wherein the controlsystem directs current to the reaction mover assembly between eachdevice manufactured by the exposure apparatus and does not directcurrent to the reaction mover assembly during the manufacture of eachdevice.
 27. The exposure apparatus of claim 22 wherein the controlsystem directs more current to the reaction mover assembly between theforming of each image on the device and than during the forming of eachimage on the device.
 28. The exposure apparatus of claim 22 wherein thecontrol system directs more current to the reaction mover assemblybetween the transfer of each row of images onto the device than duringthe transfer of each row of images to the device.
 29. The exposureapparatus of claim 22 wherein the control system directs more current tothe reaction mover assembly between each scan of the device than duringeach scan of the device.
 30. The exposure apparatus of claim 22 whereinthe control system directs more current to the reaction mover assemblybetween each device manufactured by the exposure apparatus than duringthe manufacture of each device.
 31. An exposure apparatus for formingimages on a device, the exposure apparatus comprising: an illuminationsource having an on position and an off position, in the on position,the illumination source directs a beam of light energy, in the offposition, the illumination source does not direct a beam of lightenergy; a stage base; a stage assembly that moves the device relative tothe stage base, the stage assembly including (i) a stage that retainsthe device, (ii) a stage mover assembly that moves the stage relative tothe stage base, the stage mover assembly generating reaction forces,(iii) a reaction mass assembly coupled to the stage mover assembly, thereaction mass assembly reducing the reaction forces that are transferredto the stage base, (iv) a reaction mover assembly that moves thereaction mass assembly relative to the stage base, and (v) a controlsystem connected to the reaction mover assembly, the control systemcontrolling excitation of the reaction mover assembly based upon theposition of the illumination source.
 32. The exposure apparatus of claim31 wherein the control system does not direct current to the reactionmover assembly when the illumination source is in the on position. 33.The exposure apparatus of claim 32 wherein the control system directscurrent to the reaction mover assembly when the illumination source isin the off position.
 34. The exposure apparatus of claim 31 wherein thecontrol system directs more current to the reaction mover assembly whenthe illumination source is in the off position than when theillumination source is in the on position.
 35. The exposure apparatus ofclaim 31 wherein the control system directs current to the reactionmover assembly between the forming of each image on the device and doesnot direct current to the reaction mover assembly during the forming ofeach image on the device.
 36. The exposure apparatus of claim 31 whereinthe control system directs current to the reaction mover assemblybetween the forming of each row of images on the device and does notdirect current to the reaction mover assembly during the forming of eachrow of images to the device.
 37. The exposure apparatus of claim 31wherein the control system directs current to the reaction moverassembly between each scan of the device and does not direct current tothe reaction mover assembly during each scan of the device.
 38. Theexposure apparatus of claim 31 wherein the control system directscurrent to the reaction mover assembly between each device manufacturedby the exposure apparatus and does not direct current to the reactionmover assembly during the manufacture of each device.
 39. The exposureapparatus of claim 31 wherein the control system directs more current tothe reaction mover assembly between the forming of each image on thedevice and than during the forming of each image on the device.
 40. Theexposure apparatus of claim 31 wherein the control system directs morecurrent to the reaction mover assembly between the forming of each rowof images on the device than during the forming of each row of images onthe device.
 41. The exposure apparatus of claim 31 wherein the controlsystem directs more current to the reaction mover assembly between eachscan of the device than during each scan of the device.
 42. The exposureapparatus of claim 31 wherein the control system directs more current tothe reaction mover assembly between each device manufactured by theexposure apparatus than during the manufacture of each device.
 43. Theexposure apparatus of claim 31 wherein the reaction mover assemblyadjusts the position of the reaction mass assembly relative to the stagebase with at least one degree of freedom.
 44. The exposure apparatus ofclaim 31 wherein the reaction mover assembly adjusts the position of thereaction mass assembly relative to the stage base with two degrees offreedom.
 45. The exposure apparatus of claim 31 wherein the reactionmover assembly adjusts the position of the reaction mass assemblyrelative to the stage base with three degrees of freedom.
 46. A devicemanufactured by the exposure apparatus of claim
 31. 47. A wafer on whichan image has been formed by the exposure apparatus of claim
 31. 48. Amethod for making a stage assembly for use with an apparatus, the stageassembly moving a device relative to a stage base so that the device isproperly positioned for one or more operations performed by theapparatus, the method comprising the steps of: providing a stage thatretains the device; providing a stage mover assembly that moves thestage relative to the stage base, the stage mover assembly generatingreaction forces; providing a reaction mass assembly that reduces thereaction forces transferred to the stage base; providing a reactionmover assembly that moves the reaction mass assembly relative to thestage base; and providing a control system that controls current to thereaction mover assembly based upon the status of the one or moreoperations.
 49. The method of claim 48 wherein the step of providing acontrol system includes the step of providing a control system that doesnot direct current to the reaction mover assembly during at least one ofthe operations.
 50. The method of claim 49 wherein the step of providinga control system includes the step of providing a control system thatdirects current to the reaction mover assembly between the operations.51. The method of claim 48 wherein the step of providing a controlsystem includes the step of providing a control system that directs morecurrent to the reaction mover assembly between operations than duringthe operations.
 52. A method for manufacturing an exposure apparatus forforming an image to a device, the method including the steps ofproviding a stage assembly made by the method of claim 48 and providingan illumination source having an on position and an off position, in theon position, the illumination source directs a beam of light energytowards the stage assembly, in the off position, the illumination sourcedoes not direct a beam of light energy towards the stage assembly. 53.The method of claim 52 wherein the step of providing a control systemincludes the step of providing a control system that controls current tothe reaction mover assembly based upon the position of the illuminationsource.
 54. The method of claim 52 wherein the step of providing acontrol system includes the step of providing a control system that doesnot direct current to the reaction mover assembly when the illuminationsource is in the on position.
 55. The method of claim 54 wherein thestep of providing a control system includes the step of providing acontrol system that directs current to the reaction mover assembly whenthe illumination source is in the off position.
 56. The method of claim52 wherein the step of providing a control system includes the step ofproviding a control system that directs more current to the reactionmover assembly when the illumination source is in the off position thanwhen the illumination source is in the on position.
 57. The method ofclaim 52 wherein the step of providing a control system includes thestep of providing a control system that directs current to the reactionmover assembly between the forming of each image on the device and doesnot direct current to the reaction mover assembly during the forming ofeach image on the device.
 58. The method of claim 52 wherein the step ofproviding a control system includes the step of providing a controlsystem that directs current to the reaction mover assembly between theforming of each row of images on the device and does not direct currentto the reaction mover assembly during the forming of each row of imageson the device.
 59. The method of claim 52 wherein the step of providinga control system includes the step of providing a control system thatdirects current to the reaction mover assembly between each scan of thedevice and does not direct current to the reaction mover assembly duringeach scan of the device.
 60. The method of claim 52 wherein the step ofproviding a control system includes the step of providing a controlsystem that directs current to the reaction mover assembly between eachdevice manufactured by the exposure apparatus and does not directcurrent to the reaction mover assembly during the manufacture of eachdevice.
 61. The method of claim 52 wherein the step of providing acontrol system includes the step of providing a control system thatdirects more current to the reaction mover assembly between the formingof each image on the device and than during the forming of each image onthe device.
 62. The method of claim 52 wherein the step of providing acontrol system includes the step of providing a control system thatdirects more current to the reaction mover assembly between the transferof each row of images onto the device than during the transfer of eachrow of images to the device.
 63. The method of claim 52 wherein the stepof providing a control system includes the step of providing a controlsystem that directs more current to the reaction mover assembly betweeneach scan of the device than during each scan of the device.
 64. Themethod of claim 52 wherein the step of providing a control systemincludes the step of providing a control system that directs morecurrent to the reaction mover assembly between each device manufacturedby the exposure apparatus than during the manufacture of each device.65. A method of making a wafer utilizing the exposure apparatus made bythe method of claim
 52. 66. A method of making a device utilizing theexposure apparatus made by the method of claim
 52. 67. A method forcontrolling the position of a reaction mass assembly of a stageassembly, the stage assembly moving a device relative to a stage base sothat the device is properly positioned for one or more operationsperformed an apparatus, the method comprising the steps of: connecting areaction mover assembly to the reaction mass assembly, the reactionmover assembly moving the reaction mass assembly relative to the stagebase; and controlling current to the reaction mover assembly based uponthe status of the one or more operations.
 68. The method of claim 67wherein the step of controlling current includes the step of notdirecting current to the reaction mover assembly during at least one ofthe operations.
 69. The method of claim 67 wherein the step ofcontrolling current includes the step of directing current to thereaction mover assembly between the operations.
 70. The method of claim67 wherein the step of controlling current includes the step ofdirecting more current to the reaction mover assembly between operationsthan during the operations.
 71. The stage assembly of claim 1, whereinthe device is a mask with the pattern formed thereon, and the stage is amask stage.
 72. An exposure apparatus comprising the stage assembly of71, wherein the mask stage comprises a holder to hold a plurality of themasks.